Electronics Forum | Tue Jun 09 09:40:47 EDT 1998 | Wolfgang Hantz
| We offer an upgrade service for notebooks with 486 SX/DX CPUs up to 586-133 MHz using the AMD 5x86-133 MHz CPU in the PQFP package. We are pretty succesful with this service and until today we did more than 1000 notebook upgrades this way. | Now,
Electronics Forum | Thu Aug 07 14:20:26 EDT 2003 | gdstanton
Anyone have experience soldering Lead-free components using leaded solder paste? I'm specifically interested in lead based no-clean solder paste. Any special concerns for reflow? Kyzen Cleaning? Thanks, Greg
Electronics Forum | Thu Jul 20 12:23:00 EDT 2000 | Dave F
Bob: Please help us understand the effect of changing to lead-free solder paste on our processes better. Compare the following for tin-lead and lead-free solders: * Size of stencil apertures � amount of solder necessary for a reliable solder conne
Electronics Forum | Fri Apr 29 14:16:16 EDT 2011 | ppcbs
Below is the long explanation. This defect is most commonly found with BGA components, but can arrise with all components. I see it happening more now with lead free boards that are being assembled with a no clean flux. Best short term remedy is t
Electronics Forum | Thu May 28 16:31:29 EDT 2020 | naranjafresa
Hi, does anyone know which documentation regarding to lead free solder paste is needed to demostrate that the smt assembly process is RoHS compliant? Is it enough to show the datasheet of the solder paste used?
Electronics Forum | Wed Dec 01 21:40:06 EST 2004 | Grant
Hi, High temp solder balls don't collapse in current lead based soldering, so lead free balls are similar, and don't collapse, but should still solder ok. They just look different. However I would like to know other peoples experience about reliabil
Electronics Forum | Fri Apr 03 14:42:08 EDT 2009 | rkevin
Looking for potential pastes to evaluate (success stories), and any and all paste evaluation procedures you may have used sucessfully to qualify a new product. Definition, slump, release, tack, voiding, reflow window, etc. Thanks for any and all h
Electronics Forum | Fri Oct 05 14:17:57 EDT 2018 | waveroom
i HAVE A CUSTOMER WHO IS USING A WATER SOLUBLE LEAD FREE SOLDER PASTE AND IT IS ADHERING TO THE SQUEEGEE. ANY IDEAS HOW TO SOLVE THIS ISSUE WOULD HELP.
Electronics Forum | Thu Apr 24 21:52:18 EDT 2008 | fowlerchang
We have measured the temperature of CSP solder joint. The peak temperature is 232oC and the wetting time above 217oC is 30s. But we use leaded solder paste instead of lead free solder paste. I doubt why no crack of solder joint was observed after cr
Electronics Forum | Thu Feb 27 02:55:53 EST 2020 | hexton
I want to avoid peoples preferences as they will differ and will not be a deciding factor. A heat gun will introduce risk to surrounding PTH components and having to add protection for those, will limit any gain in productivity. There is no question
