Electronics Forum | Mon May 09 15:05:01 EDT 2016 | wooly1
We are trying to reflow some Fox brand crystals to some boards but the solder will not wick up on the ends of the component. It solders fine to the under side but not to the ends. I have tried numerous things with the reflow profile but nothing seems
Electronics Forum | Mon Sep 11 09:43:14 EDT 2006 | C.K.
So, your scenario is: * Lead Free Solder Paste * Lead Free Reflow Profile * RoHS Components * Non-RoHS (Sn-Pb HASL plated)PCB If that's the case, you should be just fine running your Lead-Free process. There is literature on the topic of lead
Electronics Forum | Tue Jan 31 12:37:33 EST 2006 | carterhoward
I guess my biggest concern would be what will happen to the inner metallic layer of the leaded solder during the higher temperatures.
Electronics Forum | Fri Mar 23 03:41:19 EDT 2012 | grahamcooper22
try Almit Sn62 HM1 RMA V14L ....its the best no clean lead paste for wetting...I sell it and it has solved wetting problems many times when users have used other pastes
Electronics Forum | Fri Jun 04 16:30:10 EDT 2010 | jdm2008
I am running a cemelot 5000 and I am having trouble with the solder clogging up the needle. When the solder is removed it almost appears if it has reflowed. I am using a 22 guage needle, and the problem occurs with both type 3 and type 5 solder pas
Electronics Forum | Wed Feb 01 17:03:04 EST 2006 | grantp
Hi, What's the difference between soldering a lead free solder ball BGA onto a footprint with lead solder paste when the ball does not collapse, compared to a lead-less package. The BGA is bigger, but you rely on the solder paste only, seems to work
Electronics Forum | Fri Feb 03 16:40:24 EST 2006 | Mike
At my last employer, we ran a number of tests to make a "Hybrid" profile work (same profile Joe lists) . It worked great for everything but BGAs. The problem (6 months ago) was using parts not rated for lead free reflow temps. As the market fills wit
Electronics Forum | Mon Jan 29 09:50:37 EST 2007 | rgduval
I'm about to begin a job for a customer placing a couple of lead free BGA's/FPGA's on an assembly that doesn't need to be RoHS compatible. So...my question is...should I process this assembly with lead-free solder paste, to accomodate the lead-free
Electronics Forum | Tue Feb 28 08:08:06 EST 2006 | davef
Tin is an excellent solvent. So, whether using lead-free or leaded solder, your wire will neck to one degree or another if the material of the wire dissolves in the metal of the solder.
Electronics Forum | Mon Feb 06 09:17:35 EST 2006 | Cal Kolokoy
Mike did you have these SEM'd to be able to see the IMC's within the solder joint?
