Electronics Forum | Mon May 27 11:13:11 EDT 2013 | ericrr
Is there any good articles to read on solder paste? (just to see if I may of missed something) Sometimes I can not believe the people I have to work with. We had a panel with two “Quad Flat Package” (QFP) one in each of the two circuits, almost fr
Electronics Forum | Tue Jan 16 18:18:46 EST 2007 | greg york
Sorry that answer never really gave you the reason and ways to resolve. Reason - most composite pallets are only good up to 180C so thermal excursions at 250 or even 270c lead free kill them. Try to stay on top of cleaning as well and some pallet mat
Electronics Forum | Tue Dec 13 06:56:27 EST 2005 | adanhn
Hi Steve, What I came up with for our Soltec Sigma 6621 is to make a stainless steel wave solder bath insert.The insert with all its components eg. impeller, Chipwave assy, pump shafts, main wave assy etc. I will send for plasma nitride coating.Afer
Electronics Forum | Thu Oct 23 12:50:28 EDT 2008 | gregoryyork
Hi Dave sorry not been back the Tin/P regenerator is controlled amounts of Phos additive that metallurgically reduces the dross. We do not recommend chemical methods for dross reduction as many salts/chemicals used could be hygroscopic in nature and
Electronics Forum | Wed Jul 01 11:33:30 EDT 1998 | Upinder Singh
Hi all. I am trying to put one 20 pin thru hole connector along with the smt components on the PCB. I would appreciate if somebody can guide me in getting thru this process. I also need to know how much bigger the holes on the screen or stencil shou
Electronics Forum | Thu Oct 20 06:03:23 EDT 2005 | Slaine
during the soldering process on larger BGAs the corners can bend up or down due the large copper heatsink on top expanding quicker than the material the bga is made out of, in the worst cases this can lead to to the balls lifting out of the paste and
Electronics Forum | Tue May 28 08:32:41 EDT 2013 | emeto
Hi Eric, your problem looks like a printing issue - if the part(or group of leads) missing solder is always the same. I would say you should check: 1. Stencil for any damage at this area 2. Squegee for damages 3. Adequate pin support un der the boa
Electronics Forum | Fri Nov 09 11:55:49 EST 2001 | mparker
If you are getting solder shorts under a device, how would "hiding" the extra long pad with solder mask help? If the pad can't be seen once the device is in place, it is already "hidden". Getting your customer to redesign the pads may take some time
Electronics Forum | Tue Mar 01 15:13:22 EST 2011 | felixgutierrez
Hi Everyone. I would like your input in regards to lead free solder paste lead free. Which one is the most reliable solder for BGA's and BTC's (QFN). I have used different type of solder and on some of them i get big voids on BTC's and other one i g
Electronics Forum | Wed Jun 18 08:51:34 EDT 2008 | ldavis
We actually found the opposite to be true. Boards processed in VP are much cleaner than those processed in our air-only convection oven. We tested 5 lead free solder pastes upon implementation and found that the type of paste does affect the number
