Electronics Forum | Fri Jan 12 12:35:58 EST 2007 | realchunks
Several things to check. Are you reflowing towards higher temps for the no-lead parts? If so are you using a 63/37 paste? If so you are buring your flux off too early. Get a solder paste designed for lead free parts on a leaded baord. There are
Electronics Forum | Thu Oct 05 15:21:03 EDT 2006 | RusH
We are having significant issues with lead free parts on leaded assemblies. Particularly grainy and non-wetted solder joints. Does anyone have any solutions.
Electronics Forum | Thu Oct 05 15:58:16 EDT 2006 | RusH
Mario, Thanks for your response. We are building a leaded assembly with hot air leveled Sn/Pb pads on the PCB. In one case the component is a 7.5X5.2X1.8 wire wound ferrite inductor with Au/Sn leads. The second component is an 0808 Tantalum cap,
Electronics Forum | Thu Oct 05 15:41:36 EDT 2006 | Mario Scalzo, SMT CPE
Good afternoon. From what it sounds like is that the solder joins are not getting hot enough or if it Au, then the increase in the Au content of the joint is increasing the melting point of the final solder joint. To some extent, this will also hap
Electronics Forum | Thu Jul 19 04:38:33 EDT 2007 | chrispy1963
I took a Lead Free troubleshooting Class at SMTA in Chicago last September taught by Phil Zarrow. He told us during that seminar that its not a good practice to cross contaminate Leaded and Lead Free components but IF it is necesary than using lead
Electronics Forum | Sat Jan 15 10:45:04 EST 2005 | Brad
HI, I actually have ask the same question a while back. Yes, using lead free component in a leaded process should be no problem at all. May required just a little hotter peak temp. during reflow, to achive optimal solderability.
Electronics Forum | Mon Jan 17 11:23:49 EST 2005 | Brad
Ya Russ is right for Ti Parts they tend to use more pelladium, which requires a bit more heat average temp increase is about 10 degrees C. from 225-235. As far as optimum solder joint I look for fillets on all sides of leads. The back of the lead is
Electronics Forum | Sat Jul 28 08:37:52 EDT 2007 | davef
There is no good choice. Board Finishes: Industrial/Battelle Class 3 Environment [Reliability Knowledge Gaps: For use of Pb-free solders in High Reliability Applications, J Smetana, iNEMI Availability of SnPb-Compatible BGAs Workshop, March 1, 2007,
Electronics Forum | Wed Aug 10 09:01:15 EDT 2005 | fctassembly
Hello Joseph, Sorry for the bad news but microcracking is a well known potential condition occuring with the SAC305 alloy. Microcracking is a condition being seen with many joints soldered with the SAC305 alloy. It is technically a shrinkage cavity
Electronics Forum | Mon Feb 27 06:42:37 EST 2006 | Slaine
What are the long term issues with high tin content solders on parts plated with silver over copper? Is it possible that the silver will be absorbed by the solder then over a long period of time the tin will react with the copper causing it to part
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