Electronics Forum: lead protrusion for ai component (Page 1 of 1)

Looking for Filled via -- Embedded within pad - criteria

Electronics Forum | Thu Sep 02 15:51:15 EDT 2004 | cburress

All: IPC does not directly state any criteria for physical characteristics of what a filled via should look like when embedded within a surface mount component's pad. I am using several of these in my design, and have received PCBs that exhibi

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