Electronics Forum | Sat Jul 28 08:37:52 EDT 2007 | davef
There is no good choice. Board Finishes: Industrial/Battelle Class 3 Environment [Reliability Knowledge Gaps: For use of Pb-free solders in High Reliability Applications, J Smetana, iNEMI Availability of SnPb-Compatible BGAs Workshop, March 1, 2007,
Electronics Forum | Sat Jan 10 09:04:47 EST 2015 | jandon
class 3 requires 100% barrel fill Class 3 requires 75% vertical fill of solder for component with less or more than 14 leads. Not 100% fill.
Electronics Forum | Tue Dec 30 09:31:52 EST 2014 | rgduval
I've always approached it like this: Design your processes and perform your work to class three standards, and inspect to the standard that is acceptable. That is, all work should be performed to the highest degree of quality. When the work is ins
Electronics Forum | Tue Dec 02 07:56:40 EST 2008 | realchunks
Wow, rocket science with Nasa specs! I like it. I don't see the trick question here, so I'll continue.... IPC simply states over hang of round or flattened (coined) leads is acceptable (class 1, 2, & 3) if it "does not violate minimum electrical c
Electronics Forum | Fri Dec 07 09:43:04 EST 2001 | Russ Steiner
I have a mixed technology PCB that has SMT all on bottom, TH parts on both sides (Yes, I realize that's bad. Can't be avoided.) We have designed a 10-up panel, 2 x 5 array. There are 50 leads per bd, 500 per panel. How much time is reasonable to a
Electronics Forum | Wed Dec 09 10:45:56 EST 2015 | huske
I've put down a SOT223, close enough to your 3pin transistor, in the same situation you have. The large pin was to be soldered on a large exposed ground plane in the corner of a board, over 2"x2" exposed area. We left the paste file as is, so where
Electronics Forum | Tue Nov 28 15:10:50 EST 2006 | M. Sanders
Unfortunately, I don't have a copy of IPC-A-610 D on hand, however, I believe in IPC-610, this �floating height� between lead and pad has no maximum specification restriction. As long as there is no voiding, it is still acceptable for all 3 classes.
Electronics Forum | Sat Jun 17 08:57:23 EDT 2000 | Chrys Shea
A few more tricks to try: - Got a hot air rework machine? You can get more controlled heat on the area and lower the risk of damage to the fab. I never got topside fillets un unrelieve ground planes until I went to convection preheat on my waves.
Electronics Forum | Tue Apr 24 21:12:32 EDT 2001 | davef
I prefer mine skewered with a remoulade, yum. IPC-A-610 allows component side overhang to the lesser of either up to 25% of the component termination width or up to 25% of the width of the pad for Class 3 devices. Help us understand your problem.
Electronics Forum | Tue Dec 17 12:53:28 EST 2002 | russ
You looked one page to far in the IPC book! Fillet height of 75% is acceptable for all 3 classes. Per IPC 610 rev. C Section 6 table 6.2. A. Circumferential wetting on Primary side (top)between lead and barrel (not anualar ring) Class 1 Not spe
