Electronics Forum | Sat Oct 18 20:35:25 EDT 2008 | arosario
I see, maybe changing my peak temp in reflow will help. I'll try do eval again... Actually, once I did have evaluated a longer pre-heat but on my previous eval, I didn't change the peak temp. Maybe reflow can help compensate to my problem in the part
Electronics Forum | Sat Oct 18 09:30:43 EDT 2008 | hussman
Sounds like a part problem. You can SOMETIMES over come this with a hotter profile. We see this a lot with brokered parts. Seems like a lot of people are rejecting parts because a lot of companies haven't perfected their RoHS process, yet produce
Electronics Forum | Fri Oct 17 22:36:35 EDT 2008 | arosario
Hi All, We just started build a new product and I am encountering many non-wet rejects in our new product. I need help on what should I look into to improve our Yield. Please see below back ground 1. We are using DEK Infinity as printer. 2. We are mo
Electronics Forum | Wed Jan 02 22:05:05 EST 2002 | visionlight
What are the implication of using lead free components on lead content solder paste.
Electronics Forum | Thu Jan 03 08:32:28 EST 2002 | davef
You're correct. There's a range of issues. Two perspectives are: * TI and other suppliers has been shipping lead-free solderability protected leads on components for years. We have discussed, here on SMTnet, a need to adjust the reflow profile to
Electronics Forum | Tue Nov 19 15:18:28 EST 2002 | gswable
does anyone have concrete data on the reliability of lead free components-SN/Bi used with tin lead paste thanks
Electronics Forum | Fri Jan 04 15:42:03 EST 2002 | nwyatt
There are several implications: - some lead free alloys do not form an acceptable solder joint when used with lead contaning paste. (ie. Bismuth) - if you use both lead free and lead containing components, you will have different solder joint compos
Electronics Forum | Wed Nov 20 11:23:00 EST 2002 | Gris
Does any body know how many US or europe based component manufacturers have decided not to use Sn/Bi on lead plating. Most of far east manufacturers seem to have selected Sn/Bi on their component finish. Intresting articles on Samsung,Epson and OKI w
Electronics Forum | Wed Nov 20 09:27:28 EST 2002 | davef
There's a fair number of issues with lead and bismuth solder alloys: * Lead and bismuth alloys can form a eutectic composition of Bi52Pb32Sn16 in the grain boundaries. Melting point of the eutectic alloy is 95�C [~96�C?]. * Fillet lifting of PTH du
Electronics Forum | Wed Dec 09 09:47:32 EST 2009 | dyoungquist
I am curious as to why you need to mix.... We use a 500g cartridge with air gun. Our process is remove the cartridge from the fridge, allow it to warm up to room temperature before inserting into air gun, then apply bead of paste to the stencil. N
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