Electronics Forum | Thu Sep 01 18:53:08 EDT 2005 | Board House
Pr. I agree with some of the above responses. if you are seeing Delam issues with incoming PCB's the following should be check. 1) Check the OEM Print to what Material they are calling out to be manufactured with. 2) If they are calling out for S
Electronics Forum | Tue Aug 23 16:57:29 EDT 2005 | HOSS
50% of seeing it in a single pass. The only time we do this is if we have a board off the line that has delaminated. We'll run a sample of boards through bare to confirm that we have a bad batch. Even if we see no failures on the bare boards, we'l
Electronics Forum | Tue Jan 20 10:00:25 EST 2015 | TM
Hello We are currently cleaning stencils from both process (PbSn and lead free) in the same cleaning machine. A customer is concerned about cross contamination of lead between stencils. Is there any test kit or tool that you can suggest to test the
Electronics Forum | Mon Feb 02 22:26:09 EST 2004 | Henry
Any one who knows the international certification programme for lead-free product testing? such as IPC, IEC....... Thank you very much
Electronics Forum | Tue Feb 03 09:36:05 EST 2004 | davef
Unfortunately, IPC-D-279, IPC-TM-650, IPC-TR-464, and MIL-STD-810 will not answer your questions, because they do NOT address LF-solders. Even the tests in IPC-9701 need to be modified for LF-solders, because: * LF-solder has different creep behavior
Electronics Forum | Mon Jan 23 03:12:13 EST 2006 | adeline_ko
The FA department is using IPC or J-STD-003 to do the solderability test for the leaded PCB FA qualification. Class A. However, there is no mention of Lead free testing for the PCB bare brd. Can anyone advise whether IPC has release a solderability
Electronics Forum | Sun Apr 11 11:39:52 EDT 2010 | manchella
When we have sent some of motherboards for reliability testing in a tird party laoratory. It is found that when Dye&Pry is done after 600 cycles of Thermal Cycling, in LGA socket only one of the corner solder joing had 100% type 3 crack. All other so
Electronics Forum | Fri Jun 16 11:37:15 EDT 2006 | docker
I�m working in Solder paste manufacturing industry and my customer has complained the void issue on BGA pad. I�m internally conducting the void test on BGA pad in my Lab. I used OSP furnish board with Sn/Pb and /or lead free component using Lead free
Electronics Forum | Fri Jan 14 08:42:47 EST 2005 | Jim Zanolli
We are performing testing for lead free connector finishes. We want to run solderability tests on a series of lead free connector plating options in a series lead free PCB's. I need some advice on the most popular lead free PCB finishes. I am aware
Electronics Forum | Wed Nov 02 11:14:45 EST 2005 | Doug
I am doing lead free testing on a Vitronics selective machine with a 4 mm nozzle. The finishes I am testing are ENIG, ImSn, and ImAg. The problem I am encountering is achieving good top side wetting. Has anyone had any luck with this type of an ap
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