Electronics Forum | Mon Jun 01 19:41:03 EDT 1998 | Steve Gregory
(snip)...The solder is on the pads and the part is aligned to the pads with in 10% before going into the IR oven. Our problem is when the board comes out of the oven we have a strange skewing problem that I have never seen before. The part is not tw
Electronics Forum | Wed May 20 07:24:18 EDT 1998 | Earl Moon
| Hey there ya'll... | I was reading the messages from Earl asking where he could upload some articles he wrote, and I was asked how one goes about putting a image in the messages here... | Ya'll see down at the bottom where it says; "Option
Electronics Forum | Wed May 27 21:05:30 EDT 1998 | Steve Gregory
Hey yooze guys! Enough of the jokes between you and Earl (GRIN), let's get back to the topic...well, okay... you can tell a few more...(but good ones, 'kay?) Anyhoo...I'm not sure if ya'll are on the IPC Technet list or not, I've not seen any posts f
Electronics Forum | Tue May 19 05:42:36 EDT 1998 | Earl Moon
| Earl, | I admit that I missed your article since I seemed to have let my subscription to Circuit Fabrication Magazine expire. I am interested in your experience in this area. Is there a way to get a copy of your paper? Could you maybe post it to
Electronics Forum | Mon May 18 11:39:30 EDT 1998 | Earl Moon
| | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin package
Electronics Forum | Thu Jul 01 00:51:56 EDT 1999 | Scott Cook
| Steve, | | First of all I don't disagree with you, but 104 caps perform a power smoothing function not a data signal function. | | A PCB will still function despite a few dead cap locations. | | It won't function without certain IC lead contact
Electronics Forum | Fri Apr 10 20:27:07 EDT 1998 | Jean-Paul Clech
| I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to wheth
Electronics Forum | Tue Jan 12 17:51:41 EST 1999 | Tom Gervascio
I've been using selective soldering process for about 18 months. The major problem concerns tight spacing- the distance between the SMT pads to be masked and the thru hole leads to be wave soldered should be no less than 0.150 inches. Keep the wall
Electronics Forum | Mon Apr 06 12:32:20 EDT 1998 | Roxanne Picou
March 31, 1998-Austin, TX --- Austin American Technology announces a new Pre-Wash feature for the Mega� II to operate in conjunction with AAT's patented closed-loop regenerative cleaning process. This feature allows for an optional dual chemistry
Electronics Forum | Fri Apr 03 13:53:41 EST 1998 | Ron Beasley
| | | We are in the process of deciding whether to change a PCB product from a single board to a 3 up panel array. Could you please advise on the most effective removal design, either scoring or snap off, taking into account that material utilisati
