Electronics Forum | Thu Jul 19 04:38:33 EDT 2007 | chrispy1963
I took a Lead Free troubleshooting Class at SMTA in Chicago last September taught by Phil Zarrow. He told us during that seminar that its not a good practice to cross contaminate Leaded and Lead Free components but IF it is necesary than using lead
Electronics Forum | Fri Jul 20 08:16:38 EDT 2007 | chrispy1963
I agree that it would be crazy to think that every part a company manufactured had to be re-engineered to allow for higher temps. Out of the question and I NEVER implied that at all. What I said was that Zarrow told us that it was alright to use lea
Electronics Forum | Fri Jul 20 08:09:09 EDT 2007 | chrispy1963
In passives I dont know if anything changed at all other than the terminal plating. As for Active components there has been much engineering done to allow for the extra heat needed to liquify say SAC305 or other lead free pastes without damage to th
Electronics Forum | Thu Oct 05 15:58:16 EDT 2006 | RusH
Mario, Thanks for your response. We are building a leaded assembly with hot air leveled Sn/Pb pads on the PCB. In one case the component is a 7.5X5.2X1.8 wire wound ferrite inductor with Au/Sn leads. The second component is an 0808 Tantalum cap,
Electronics Forum | Mon Jul 16 09:53:36 EDT 2007 | ed_faranda
Yes, you can use lead-free parts in a leaded process. And the other is true as well, no-lead free parts in a leaded process. BUT, you should not use leaded parts through a non-lead wave solder process and of course, your board will not be RoSH.
Electronics Forum | Fri Jul 13 16:07:42 EDT 2007 | wana
Hello All. Can the experts in the lead free field guide me to the articles / data confirming that it is OK to use lead free components in the normal "leaded" (Pb) SMT process. And also if any changes in the process would be required to be made. Th
Electronics Forum | Mon Jul 16 10:28:08 EDT 2007 | wana
Thanks guys for the suggestions. But, what I am looking for is data, papers, articles to support this process of using lead free parts in leaded process. Again thanks for any help that you can provide.
Electronics Forum | Thu Jul 19 09:23:52 EDT 2007 | patrickbruneel
Chris, To my knowledge the only difference between leaded and lead-free components is the termination plating. What has changed in the component design that makes them resistant to higher temperatures?
Electronics Forum | Mon Jul 16 10:51:09 EDT 2007 | patrickbruneel
D. Hillman, et al., �The Impact of Reflowing a Pb free Solder Alloy Using a Tin/Lead Solder Alloy Reflow Profile on Solder Joint Integrity,� International Conference on Lead-free Soldering, CMAP, Toronto, Ontario, Canada, May 24-26, 2005, http://www.
Electronics Forum | Sat Jul 14 08:49:16 EDT 2007 | davef
While you're waiting for others to respond, search the fine SMTnet Archives.
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