Electronics Forum | Thu Oct 31 12:33:14 EDT 2013 | pbarton
You should have no difficulty with QFN or QFP parts when using non-RoHS solder. The QFP's are most likely to have tin plated leads and the metallisation on the QFN lands the same, or ENIG. Check the component part datasheets to verify the plating an
Electronics Forum | Thu Oct 31 12:37:37 EDT 2013 | pbarton
You should have no difficulty with QFN or QFP parts when using non-RoHS solder. The QFP's are most likely to have tin plated leads and the metallisation on the QFN lands the same, or ENIG. Check the component part datasheets to verify the plating an
Electronics Forum | Mon Jul 16 10:51:09 EDT 2007 | patrickbruneel
D. Hillman, et al., �The Impact of Reflowing a Pb free Solder Alloy Using a Tin/Lead Solder Alloy Reflow Profile on Solder Joint Integrity,� International Conference on Lead-free Soldering, CMAP, Toronto, Ontario, Canada, May 24-26, 2005, http://www.
Electronics Forum | Thu Jul 19 04:38:33 EDT 2007 | chrispy1963
I took a Lead Free troubleshooting Class at SMTA in Chicago last September taught by Phil Zarrow. He told us during that seminar that its not a good practice to cross contaminate Leaded and Lead Free components but IF it is necesary than using lead
Electronics Forum | Fri Jul 20 08:09:09 EDT 2007 | chrispy1963
In passives I dont know if anything changed at all other than the terminal plating. As for Active components there has been much engineering done to allow for the extra heat needed to liquify say SAC305 or other lead free pastes without damage to th
Electronics Forum | Mon Jul 16 10:26:54 EDT 2007 | davef
Ed: We agree with you that leadfree parts can be used with leaded paste. We disagree that lead part can be used with leadfree paste. Here is link to a previous discussion here on SMTnet on the topic: http://www.smtnet.com/forums/Index.cfm?CFApp=1&M
Electronics Forum | Mon Jul 16 10:17:22 EDT 2007 | realchunks
Yes you can use no-lead parts in a leaded process. Your solder joints will be weaker than they once were unless you change your solder paste. You can try to improve this by running a hotter reflow temp, but be careful since your flux was not design
Electronics Forum | Thu Jul 19 11:59:21 EDT 2007 | hussman
Phil is wrong. In the real world, we know that part mfgers have not changed every one of their parts to make them "high temp". They just changed the plating. Anyone who thinks otherwise, has never run a profile or touched a warm board coming out o
Electronics Forum | Sun Mar 12 01:58:44 EST 2006 | grantp
Hi, We have been soldering lead free BGA's onto products with lead based paste, and we have had no increase in defects at all. We have used a standard lead paste profile, so we are not altering the temps anything from what's recommended by the paste
Electronics Forum | Tue Mar 07 12:06:56 EST 2006 | billyd
muse- I agree with you. You should never mix chemistries if you don't absolutely have to. If you HAVE to, you can go with a lead free BGA with leaded paste with much fewer defects than the other way around.
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