Electronics Forum | Mon Jul 16 10:26:54 EDT 2007 | davef
Ed: We agree with you that leadfree parts can be used with leaded paste. We disagree that lead part can be used with leadfree paste. Here is link to a previous discussion here on SMTnet on the topic: http://www.smtnet.com/forums/Index.cfm?CFApp=1&M
Electronics Forum | Mon Jul 16 10:17:22 EDT 2007 | realchunks
Yes you can use no-lead parts in a leaded process. Your solder joints will be weaker than they once were unless you change your solder paste. You can try to improve this by running a hotter reflow temp, but be careful since your flux was not design
Electronics Forum | Thu Jul 19 11:59:21 EDT 2007 | hussman
Phil is wrong. In the real world, we know that part mfgers have not changed every one of their parts to make them "high temp". They just changed the plating. Anyone who thinks otherwise, has never run a profile or touched a warm board coming out o
Electronics Forum | Thu Jul 19 04:38:33 EDT 2007 | chrispy1963
I took a Lead Free troubleshooting Class at SMTA in Chicago last September taught by Phil Zarrow. He told us during that seminar that its not a good practice to cross contaminate Leaded and Lead Free components but IF it is necesary than using lead
Electronics Forum | Mon Jul 16 10:51:09 EDT 2007 | patrickbruneel
D. Hillman, et al., �The Impact of Reflowing a Pb free Solder Alloy Using a Tin/Lead Solder Alloy Reflow Profile on Solder Joint Integrity,� International Conference on Lead-free Soldering, CMAP, Toronto, Ontario, Canada, May 24-26, 2005, http://www.
Electronics Forum | Fri Jul 20 08:09:09 EDT 2007 | chrispy1963
In passives I dont know if anything changed at all other than the terminal plating. As for Active components there has been much engineering done to allow for the extra heat needed to liquify say SAC305 or other lead free pastes without damage to th
Electronics Forum | Thu Oct 05 15:58:16 EDT 2006 | RusH
Mario, Thanks for your response. We are building a leaded assembly with hot air leveled Sn/Pb pads on the PCB. In one case the component is a 7.5X5.2X1.8 wire wound ferrite inductor with Au/Sn leads. The second component is an 0808 Tantalum cap,
Electronics Forum | Thu Jul 20 13:01:07 EDT 2000 | qsheng
What is the difference of formulation No-Clean Sn63 with No-Clean lead free paste? Is there techniocal data in detail for performance property of No-Clean lead free paste (for example, viscosity, solderability, tack, print life, reflow profile)? Is
Electronics Forum | Fri Jan 12 12:35:58 EST 2007 | realchunks
Several things to check. Are you reflowing towards higher temps for the no-lead parts? If so are you using a 63/37 paste? If so you are buring your flux off too early. Get a solder paste designed for lead free parts on a leaded baord. There are
Electronics Forum | Thu Jul 20 13:08:35 EDT 2000 | Bob Willis
The solder paste formulation is different 63/37 is a tin lead alloy so t here is one difference from a lead free. Yes you can get no clean lead free products but if you compare the amount of visible residues they will be normally higher. So far most
