Electronics Forum | Thu Jan 31 18:14:40 EST 2008 | boardhouse
Hi Felix, First thing to verify is that your supplier is actually suppling you with the correct material. China is known for not keeping with the requested materials and will substitute if not controlled. I would recomend ITEQ, TUC or Nan ya for of
Electronics Forum | Wed Jun 02 09:50:00 EDT 1999 | Earl Moon
| Hello all | I have a question concerning whether or not there is any special requirements to follow for assembly of a Polyimide PCB card. The customer has the following information on there documentation but since we have never built anything with
Electronics Forum | Wed Jul 19 11:06:42 EDT 2000 | polymer
Where can I find laminates containing non-halogenated PCB? I'm especially interested in FR-4 and CEM-3, 1.6 mm 25um. Thanks in advance! Dr. Lennart Johansson Polymer Support
Electronics Forum | Tue Jun 08 08:27:14 EDT 2004 | michaeljm
I would like to see the report from MacDermid. We have samples of ag boards in which the underside of PCB pad has been plated between the PCB laminate and pad.
Electronics Forum | Thu Oct 29 16:27:37 EDT 2009 | bhartman
Does anyone have experience with the smoke release properties of PCB laminates? I need to pass UL 2043 and I know FR4 does not pass. I also need to be ROHS and otherwise UL listed/recognized material. Thanks.
Electronics Forum | Mon Sep 23 02:10:18 EDT 2019 | sssamw
It would kill the component on the opposite side, be careful to bent a PCB especially with component installed. Be sure the bent warpage is no higher than the component permitted or not high to cause de-lamination.
Electronics Forum | Mon Jun 14 12:11:54 EDT 1999 | Earl Moon
| We are a medium sized PCB assy. house manufacturing about 2000 motherboards a day. There is a major problem we are facing at the wave soldering stage, i.e. warpage of the PCB. As soon as the PCB touches the wave it warps severely from the centre
Electronics Forum | Wed May 07 21:20:53 EDT 2008 | davef
Causes of Delamination ["Quality Assessment of Printed Circuit Boards" Lund, Preben; Bishop Graphics 1985 0137450354] The reason for delamination is epoxy starvation in the glass cloth layers or an incomplete curing of the base material. It has been
Electronics Forum | Sat Aug 03 07:29:20 EDT 2002 | davef
IPC-PE-740 "Troubleshooting for Printed Board Manufacture and Assembly" has words to the effect of � 1.5---BAKING Laminate materials are baked several times during the manufacture of a printed wiring board. There are four major reasons for
Electronics Forum | Fri Jul 16 13:33:31 EDT 1999 | Dale
We are converting from COB to SMT on a product line and want to optomize the PCB as far as Laminate, plating, passivation etc. This is a high temp application 150C. We are presently using BT Laminate but would like to get away from this. We are lo
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