Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
Electronics Forum | Fri Mar 29 10:11:02 EDT 2019 | cyber_wolf
“For a number of years now, work has been proceeding in order to bring perfection to the crudely conceived idea of a transmission that would not only supply inverse reactive current for use in unilateral phase detractors, but would also be capable of
Electronics Forum | Mon Nov 01 11:43:45 EDT 2010 | patrickbruneel
Jacki, Lead-free Cu based alloys with melting point below 210C don’t exist.
Electronics Forum | Fri Apr 16 11:07:53 EDT 1999 | Vic Lau
| | We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have t
Electronics Forum | Sun Jun 13 07:57:15 EDT 2004 | Grant
Hi, We have been offered some lead free BGA parts in place of normal lead solder BGA parts in our process, and because we can get them faster it would be a good option. However does anyone know if we can use them as normal. I assume the balls won't
Electronics Forum | Wed Jun 16 11:38:50 EDT 2004 | russ
Am I getting confused here? What about the the CBGA packages that we have been doing for 5-6 yrs? We never reflowed those balls since we couldn't due to the alloy. I have been informed that if you increase paste volume to ensure a full fillet aroun
Electronics Forum | Fri Feb 09 02:30:50 EST 2007 | Muhammad Haris
What are Resins, Solvents, Activators, and Thickening Agents in Solder Paste and what are their helpful and harmful effects? AND What are the purposes/properties and effects of Sn(Tin), Pb(Lead), Ag(Silver), Bi(Bismuth), In(Indium), Cu(Copper), Ni(
Electronics Forum | Wed Nov 20 11:23:00 EST 2002 | Gris
Does any body know how many US or europe based component manufacturers have decided not to use Sn/Bi on lead plating. Most of far east manufacturers seem to have selected Sn/Bi on their component finish. Intresting articles on Samsung,Epson and OKI w
Electronics Forum | Fri Nov 17 14:42:06 EST 2006 | billwestiet
Mark, This is a big topic. Where are you located, it would probably be best to hook you up with someone in your area. Anyhow, lead or lead free should be based on whether the circuits are lead or lead free. I would guess that cell phones would all
Electronics Forum | Mon Nov 07 08:27:56 EST 2005 | chunks
It could be you are drying out your solder paste. Most flux formulations are alcohol based and after a few hours can dry out. This can can lead to dewetting and solder balling as well. Especially if you do not homeplate your R's and C's. A simple
