Electronics Forum | Wed Oct 26 10:40:43 EDT 2005 | patrickbruneel
Jimmy, We've been soldering tin plated components and Ni/Sn (100% Tin) boards with leaded solder in the 80's in hirel and military applications. We never experienced reliability issues with the mechanical or electrical properties of the solder joint
Electronics Forum | Tue Oct 25 15:19:15 EDT 2005 | jimmyjames
Sorry this is such a long thread but I would like as much input as possible to everything I ramble on about... :) ------------------------------------------------------ We are now seeing more and more RoHS parts showing up in our SMT inventory and
Electronics Forum | Tue Oct 25 16:27:46 EDT 2005 | stepheniii
It is not OK to use leadfree BGA's with a lead process. Other parts "should" be reverse compatable. But I first saw problems over 5 years ago with Paladium leads and a lead process. Don't confuse saying "it's ok to use lead free parts in a leaded p
Electronics Forum | Sat Feb 24 09:07:03 EST 2024 | emanuel
Not very long, minutes
Electronics Forum | Mon Feb 26 20:05:09 EST 2024 | alexv
Leaded solder is liquidus at 183C, 220C is max. Sounds to me your boards might be contaminated or the plating is poor and allows oxidation. Without seeing the boards or profile, I recommend you slow down your oven for a longer soak, to allow the acti
Electronics Forum | Fri Feb 16 09:01:05 EST 2024 | emanuel
I am confused about the parameters of the reflow profile needed to solder lead free components. We assemble boards for automotive modules required with leaded solder paste. The boards have ENIG finish. The problem is that I see some wetting issues, v
Electronics Forum | Fri Feb 23 14:51:48 EST 2024 | carl_p
Just another thought - how long is the printer idle for between boards? is it long enough to have the chemicals start to separate within the paste?
Electronics Forum | Fri Feb 23 09:35:36 EST 2024 | emanuel
We have the standard profile as a template made according to the solder paste specs. For some boards we measure the result at 2 points, on the board itself and on top of a sensitive SOT263 module and adjust accordingly. The solder paste is well kept,
Electronics Forum | Fri Feb 23 09:12:13 EST 2024 | carl_p
How have you created the oven profile? Have you taken into account the heat soak from the components/board/carrier etc. Is the paste being mixed correctly before use, is the paste in its use by date & at ambient temp etc? I thought almost all the
Electronics Forum | Fri Feb 23 11:29:02 EST 2024 | carl_p
Would you be able to post an image of the joint in concern? Sounds a good problem to resolve. Guessing you have used an external profiler & not the oven built in type? If 100% certain the profile is correct I would focus on the paste from my exper
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