Electronics Forum | Fri Jul 27 10:07:18 EDT 2007 | rgduval
Our preference has been ENIG. We find that we achieve higher quality (visually) soldering for through hole and surface mount parts, with less handling issues than when we use white-tin, or immersion tin. We are about to do a test on some boards tha
Electronics Forum | Mon Jul 30 10:17:26 EDT 2007 | davef
immersion ...easily changes color.. See that's the GREAT thing about immersion coatings. If they change color, they probably will not solder well. Try that with other coatings.
Electronics Forum | Thu Jul 26 23:57:47 EDT 2007 | gioblast
Good day.. anyone who have read the best guide on pb-free pcb plating?? I know immersion is the best but the storage controls sucks..easily changes color..ANYONE WITH A BETTER kNOWLEDGE ON HOW TO CONTROL? OR better plating ...enig?? why?? please. all
Electronics Forum | Sat Jul 28 08:37:52 EDT 2007 | davef
There is no good choice. Board Finishes: Industrial/Battelle Class 3 Environment [Reliability Knowledge Gaps: For use of Pb-free solders in High Reliability Applications, J Smetana, iNEMI Availability of SnPb-Compatible BGAs Workshop, March 1, 2007,
Electronics Forum | Tue Sep 13 08:45:51 EDT 2011 | rgduval
Lead free solder does tend to resemble cold solder joints after processing. Generally, this is acceptable. The latest IPC 610 has pictures of acceptability of lead free solder joints, which you can use to compare to the joints that you are seeing o
Electronics Forum | Wed Sep 14 09:19:30 EDT 2011 | swag
Target those specific parts/leads with a thermal-couple and a mole and try to get the peak reflow temps up to 225 C. It's not a cure but it will improve the apperance of the solder joints.
Electronics Forum | Mon Sep 12 10:41:50 EDT 2011 | processmxli
Hi All We have run SMT process with SnPb but we’re installing some lead free components like capacitors and resistor lead free. After the reflow oven all components have good appearance with solder join sheen. But the lead free components the solde
Electronics Forum | Thu Oct 05 15:58:16 EDT 2006 | RusH
Mario, Thanks for your response. We are building a leaded assembly with hot air leveled Sn/Pb pads on the PCB. In one case the component is a 7.5X5.2X1.8 wire wound ferrite inductor with Au/Sn leads. The second component is an 0808 Tantalum cap,
Electronics Forum | Thu Nov 03 09:43:55 EST 2005 | lupo
Check flux penetration and type of flux. How much is solid contents. The solder filling is better under Nitrogen. Check the time (speed) of the nozzle whether is correct. Usually For SAC305 the temperature of bath is 320C/degrees, but only for sel
Electronics Forum | Wed Feb 20 23:17:34 EST 2002 | surachai
I AM JUST EVALUATION LEAD FREE EVALUATION AND FOUND THE BIG PROBLEM OF SOLDER CRACK BETWEEN TERMINAL OF COMPONENT AND THE INTERMETALLIC LAYER OF LEAD FREE ALLOY BUT DON'T FIND ANY CRACK BETWEEN SOLDER AND SURFACE OF PCB , COULD YOU HELP ME VERIFY T
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
