Electronics Forum | Thu May 27 05:41:38 EDT 2004 | 6611
length of each furnace I want to know the length of each furnace heat zone (1- 10 zone and buffer)in unit centimeters of BTU PARAGON 150 Thankyou,
Electronics Forum | Thu May 27 09:32:08 EDT 2004 | russ
Do you have a tape measure?
Electronics Forum | Thu Nov 29 22:38:05 EST 2007 | shy
Hi Dback, Yes, i'm open "dog bone" aperture for my chip component. this is to prevent solder ball issue. For fine pitch i'm opening square with full length and half width to prevent bridging. Btw, if "dog bone" is not for chip component, what is your
Electronics Forum | Thu May 26 21:21:36 EDT 2005 | thaqalain
The non-metalized part,or non-leaded part of any electronic component is called *Termination *Lead *Body *Heel
Electronics Forum | Tue Nov 01 12:36:19 EST 2005 | moonshine
What's your pad geometry/sizes relative to lead width/length? Revisit this and my free website: http://www.moonmanondarkside.com and see some examples and download some free documents. MoonMan
Electronics Forum | Tue Mar 04 09:12:35 EST 2008 | davef
Q1. What would you recommend for the best practice or comparison? A1. We'd go with dip & look. It's easy and cheap, requires no advanced degrees in measurology. Have you reviewed "J-STD-002B - Solderability Tests for Component Leads, Terminations, Lu
Electronics Forum | Wed Oct 09 13:52:17 EDT 2019 | valletta
Hi Aurther, Thanks for a prompt reply. I agree but unfortunately our AOI is 2D and misses a lot of solder defects especially on connector terminals which are surface mount. We are also dependent on operator at AOI to mark the defect if caught by AOI
Electronics Forum | Fri Jul 07 16:29:41 EDT 2000 | dstamour
Does anyone know of anybody who makes a device to take Gasfets off of tape and reel trim them to length and present them to the machine (zevatech, juki) for placement. An alternative would be to take them off tape and reel trim them and re tape and r
Electronics Forum | Thu Mar 08 22:24:45 EST 2001 | davef
Sounds like you've done a good job of troubleshooting. Two thoughts are: 1 An alternative to using a hotter flux that the others mentioned is to use components with more solderable terminations. [A firm grasp on the obvious.] 2 You spoke about
Electronics Forum | Fri Mar 09 08:25:13 EST 2001 | CAL
We have seen some problems with component end cap solder terminations not being symetrical. i.e. If one end on the cap has a larger solder ternination this sometimes is enough surface area during reflow to lift the opposite side of the component. We
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