Electronics Forum | Wed Mar 05 11:54:44 EST 2003 | ruggi
Hi JFB, I think this is an unnecessary activity, but it may depend on your RH. We are in the Spokane, WA area, and the RH avg year round is about 25-30%. We have never baked our PCBs in the 9 years I've been here across 800+ varieties, including
Electronics Forum | Mon Mar 31 11:14:59 EST 2003 | pr
We found that the Pro-flow cartridges had paste in them we couldn't get out, that seemed more wasteful than the Rheo-pump. We ran both and I agree with the previous posting, that comfort level with the machine 2D, software etc. were more important. W
Electronics Forum | Sat Mar 29 13:35:32 EST 2003 | MA/NY DDave
Hi Back later on this tread, yet I did want to slightly correct one thing DaveyF wrote. Again only slightly. Even at 90C, moisture does start to leave the board. Now it doesn't do it so well as above 100C at sea level atmospheric pressure, yet it s
Electronics Forum | Tue Apr 08 11:52:34 EDT 2003 | Chrissie
I am currently trying to creat a model to calculate attrition on our SMT line. A new product is coming into our cleanroom and we have problems with the current product and atttrition levels. One of our main problems is a large batch for us (space ind
Electronics Forum | Wed Apr 30 08:00:33 EDT 2003 | pjc
Jason, In Transmission AXI the entire solder joint volume is imaged, not just a slice (no missing information) as with Cross-Section. Also, there is no signal loss from mechanical or digital image reconstruction (highest contrast and edge strength).
Electronics Forum | Mon Apr 28 11:37:30 EDT 2003 | terrapinstation
Chrissie, There is no "silly" question. It seems to me that, not with standing the issues highlighted in your posting, notably - risks, time, etc.. Your time would be much better spent determining the reason for the reject. If your placement equip
Electronics Forum | Thu May 01 13:56:45 EDT 2003 | kmorris
Dave: After the stencil was made with apertures for a connector on this PCB, it was discovered that the connector would have to be handsoldered after SMT reflow. If the solder deposits are left to reflow on the pads, it makes it difficult for the o
Electronics Forum | Wed May 07 20:55:35 EDT 2003 | davef
Bollocks!!!! We are unfamiliar with the term overturn, but it can not be that uncommon. Our intial inclination is to barrel into this SMT Engineer's nap-zone and blast him, but it might not be a politic approach. So, maybe we'll temper the tack we
Electronics Forum | Wed May 21 09:31:09 EDT 2003 | caldon
I need to first understand what "Peeled the BGA off" means. Was heat used? was this the pry and lift method? We had shorts under some BGA's we have and the solder was bridging from lead to lead but not on the board level at the FR4 on the BGA creati
Electronics Forum | Wed May 21 15:47:34 EDT 2003 | JB
We have an HSP 4796, if the feeder mechanism is the same, this may help you a bit. First make sure that the componet definition is right on the component library. Tape or Embossed. Second, the component thickness vs actual thickness. Is the pick u
