Electronics Forum: level (Page 87 of 232)

Defect of the Month - Solder Squeeze Out

Electronics Forum | Thu Feb 07 12:04:11 EST 2019 | davef

Over the years, Bob has contributed many videos and pictures that have help identify and solve production issues. I recall a vid of a bug-up BGA being heated to liquious that showed the balls swelling in the heat to the level that they bridged. Bril

QFN standoff, industry standard

Electronics Forum | Wed Mar 27 04:32:49 EDT 2019 | pavel_murtishev

Charliem, Thank you for the input. Following this logic, in case if there are no soldering issues, pad coverage and voiding levels are within acceptable limits and a gap between BTC and pad let us say 200um, this could be accepted, right? IPC-A-61

QFN Side fillet

Electronics Forum | Fri Jul 19 13:02:01 EDT 2019 | davef

Double-check me on this, but I don't believe that A-610 [IPC-A-610] requires side fillets on QFN solder connections, because the sides of most terminations are not plated. Plating on the bottom of the termination is sufficient for a proper solder con

Self Tensioning Frames

Electronics Forum | Tue Jan 28 09:51:01 EST 2020 | stephendo

I never understood why people would use foils. I worked at one place where maybe half the stencils were used one time and we got at least 2 to 3 new stencils a week on average. The extra space they took up was well worth not having to handle foils. W

Why gold plating on PCB?

Electronics Forum | Fri Feb 28 08:48:00 EST 2020 | SMTA-Joe

We've made the decision to move towards Gold Immersion on our PCBs to eliminate flatness issues with QFNs and BGAs. Land/component pad geometry, population density, and other factors, have made it necessary to ensure a near perfectly flat surface tha

SOLDER SHORT DUE TO VOID IN BGA

Electronics Forum | Tue Jun 16 18:03:41 EDT 2020 | rsatmech

Thanks for your response. Shorts are happening in different locations(Not same pad repeated) .kindly note these are happening one in 10kThat's the challenge to understand the exact issue. Only one short. Vias - i will check and updated. Yes it's

My Data MY15 Z AXIS Zero Point Unstable

Electronics Forum | Mon Jun 28 17:17:23 EDT 2021 | SMTA-64387687

The 2 big ribbon cables, on top of the X wagon. They run from the booster board, in the back, to the board on top of the X-wagon. They wear out and need to be replaced, periodically. Since, the tool cycle works, the Z-motion is probably working ok. I

Mydata error messages

Electronics Forum | Wed Jun 30 20:35:04 EDT 2021 | rgduval

I have no idea what the messages mean specifically...but, it sounds like linux level errors, rather than TPSYS errors. Start by getting to a dos prompt, and navigate to those directories cited and make sure things look ok (files are there, directo

solder pot analysis

Electronics Forum | Wed Jul 14 21:14:58 EDT 2021 | mekmat544

Hello, I would lke to ask you about one issue. I am finding maximal level of impurity in solder pot with solder Sn99Cu1. I have limits for pure (delivered) solder, but I can not find limit for solder in pot in process. Could you help me where I can f

Best solder paste printer with solder paste inspection and AOI function-Recomendation

Electronics Forum | Wed May 25 23:45:04 EDT 2022 | SMTA-64387687

1. The jetting head flies very low to the level of the board. So, performing AOI function will crash the head. 2. AOI is performed close to the end of the line, after P&P or reflow. Are you planning to run the boards back-and-forth, on the line? 3. L


level searches for Companies, Equipment, Machines, Suppliers & Information