Electronics Forum | Mon Aug 22 18:25:54 EDT 2016 | cox1
I have a MS level 3 component that has been on the shelf for 7 years. Should it be baked before usage. The HIC card reads ok- and it was stored with desiccant. History of the part is unknown, was purchased from franchised distribution.
Electronics Forum | Fri Dec 17 02:43:24 EST 2010 | grahamcooper22
Ideal storage conditions to stop pcbs absorbing moisture is at less then 5% RH, for example in sealed moisture barrier bags. You mention that storage was at 40~70%...at these levels the pcb will absorb quite a bit of moisture. Your baking time was no
Electronics Forum | Thu Nov 10 20:39:44 EST 2022 | SMTA-64386598
The solderability shelf life of ENIG is related almost entirely to diffusion of O2 through the gold plating. When O2 diffuses through the gold, the underlying nickel is oxidized rendering it unsolderable (with ENIG - you solder to Ni, the gold dissol
Electronics Forum | Fri Feb 16 03:02:02 EST 2018 | robl
100% agree with dwl. last year one of our 3rd party delivery partners got rear ended resulting in about 30% of a $120,000 shipment being written off. If it hadn't been for foam lined flight cases we would have lost the lot. Also for smaller 3rd pa
Electronics Forum | Mon Feb 09 08:34:50 EST 2015 | saoasasd
In my case most of the PCBs are OSP finishing and worst case of MSD component on bottom side is level 3 (168 hours). You mean that PCB shelf life with bottom side assembled shoud be 84 hours?
Electronics Forum | Mon Jun 21 16:11:41 EDT 1999 | John Thorup
| | I am finding that some of our IC's are coming from the supplier with the humidity gauge in the bag reading 10-20%. Has anybody done any tests to determine what humidty level in a package will cause problems during reflow? | Usually a proper m
Electronics Forum | Mon May 07 08:46:18 EDT 2001 | CAL
Searching the IPC website is a good start. http://www.ipc.org Some standards you may want to look over are.... IPC 600, IPC 610, J-STD-001 "riveting and circuit cards into metal shelf" definitely has my curiosity level elevated. Since you know your
Electronics Forum | Mon Dec 30 23:37:47 EST 2019 | agoesfirmanto
Hello All, I am a SMT Engineer from Indonesia, I am facing the problem of soldering balls in only one IC location, in other areas there are none. solder ball defect almost 30%. I have done several actions but failed to reduce the solder ball. 1.
Electronics Forum | Mon Jul 09 20:46:22 EDT 2001 | davef
Is the glue intended for printed SMD attach? 3 Are you following all the manufacturer�s glue shelf life recommendations? 4 Are you observing all the manufacturer�s glue working life guidelines? Finally, what level of skewing are we talking about?
Electronics Forum | Mon Feb 09 10:51:10 EST 2015 | jax
If solderability is the only concern, then there is no standard time. Multiple factors involving OSP thickness, Flux activation levels, profile parameters, storage environment will drive the problem. You just need to perform tests to determine your m
