Electronics Forum | Mon Oct 25 21:49:14 EDT 2004 | davef
First, any results of pull or shear tests are unscientific at best. [We pop our BGA from boards with, appropriately enough, a beverage can opener.] Second, we have no have problems with your ENIG specification. Third, as with your customer, we'd e
Electronics Forum | Sun Apr 11 11:39:52 EDT 2010 | manchella
When we have sent some of motherboards for reliability testing in a tird party laoratory. It is found that when Dye&Pry is done after 600 cycles of Thermal Cycling, in LGA socket only one of the corner solder joing had 100% type 3 crack. All other so
Electronics Forum | Tue Jul 02 02:50:55 EDT 2002 | ianchan
Hi mates, was going thru the IPC-A-610C Standards, and noted BGA voids stands somewhere between 10%-25% voids permissible in the solder "ball" bump, after reflow process. Was wondering, hypothetical case study, is there any specification for voids
Electronics Forum | Wed Jun 13 03:37:06 EDT 2001 | ianchan
Hi mates, I did a recent shear test (destructive test), on a uBGA liken product, and noted the post-shear solder joint, had clean "smooth" visual appearance under the uBGA pad, however the matching pcb pad was clearly lifted clean. Question: 1) how
Electronics Forum | Fri Aug 08 12:46:02 EDT 2003 | davef
When I was a salty old fart in the Navy, we sent the babes from the turnip patch off on snipe hunts. Shear tests are [in my opinion] senseless. The shear stress you measure depends more on the shear rate and on the point where the force is applied
Electronics Forum | Thu May 06 11:37:48 EDT 2010 | davef
There is no specification. Shear tests are very material / operator dependent. BALL SHEAR TESTING OF RAW BGA DEVICES: A total of 3 devices were subjected to ball shear testing. Results of the testing indicated shear values in the range of 0.7-1.25
Electronics Forum | Tue Jun 01 12:57:52 EDT 1999 | John Sims
I need to perform shear tests on components that have been glued prior to wave soldering. Can any one recommend a shear tester and some standardized info on testing? We have had problems with poor glue bonds and would like to implement a test metho
Electronics Forum | Mon May 10 15:02:37 EDT 2004 | davef
There's no such specification. Not should there be. Shear tests [in our opinion] are senseless, because: * Solder joint strength in pull/shear varies with lead geometry, solder volume, lead metal/metallization, and the way the test is done. * She
Electronics Forum | Wed Oct 06 22:55:14 EDT 2004 | davef
Your customer is correct. Components should not fall a board during a reasonable drop test. A shear test poorly represents a drop test. A drop test represents a drop test very well. If you want to proceed with shear testing, search the fine SMTne
Electronics Forum | Thu Feb 15 19:41:38 EST 2001 | davef
What do you mean by "But after performing temperature cycle test, the former aging rate (from the shear strength ) seems faster than the latter."? Comments are: I can't recall having heard the term "precipitation hardness" [not that that means anyt
