Electronics Forum | Wed Oct 06 22:55:14 EDT 2004 | davef
Your customer is correct. Components should not fall a board during a reasonable drop test. A shear test poorly represents a drop test. A drop test represents a drop test very well. If you want to proceed with shear testing, search the fine SMTne
Electronics Forum | Thu Feb 15 19:41:38 EST 2001 | davef
What do you mean by "But after performing temperature cycle test, the former aging rate (from the shear strength ) seems faster than the latter."? Comments are: I can't recall having heard the term "precipitation hardness" [not that that means anyt
Electronics Forum | Fri Aug 05 14:38:50 EDT 2011 | bandjwet
Does anyone know of a vendor able to perform ball shear testing services per JES stds? Thanks! BWET
Electronics Forum | Wed Jun 02 06:53:44 EDT 1999 | Earl Moon
| I need to perform shear tests on components that have been glued prior to wave soldering. Can any one recommend a shear tester and some standardized info on testing? We have had problems with poor glue bonds and would like to implement a test met
Electronics Forum | Wed Mar 02 05:01:41 EST 2005 | ABHI
Are your packages mounted on boar using sockets or BGA balls? LGA's are usually no issue and are simple compared to BGA. No issue on missing balls or ball drop issues. However, LGA's need quite a bit of mounting / holding pressures during test and mo
Electronics Forum | Fri Sep 03 06:53:38 EDT 2010 | arjan
Yes, we assembled a lot of QFN in the last years, but we don't have a X-ray machine by ourself, so we cant't inspect each device. This type LGA was designed on a prototyping board of our customer so we would validate our LGA reflow process and a rese
Electronics Forum | Mon Jun 07 11:21:38 EDT 1999 | Brian Wycoff
| | I need to perform shear tests on components that have been glued prior to wave soldering. Can any one recommend a shear tester and some standardized info on testing? We have had problems with poor glue bonds and would like to implement a test m
Electronics Forum | Mon Dec 17 08:41:45 EST 2001 | davef
Search the fine SMTnet Archives to develop background on this topic.
Electronics Forum | Mon Dec 04 03:40:43 EST 2000 | jmlasserre
Hello, When we discover the broken caps, there are missing and we can observe only either the 2 terminaisons or a small part of ceramic. The defect is due to a shock during the process but it's possible that the caps are fragilized during an operati
Electronics Forum | Tue Mar 22 07:39:05 EST 2005 | davef
There is no standard. This is a relative test. If you wish to do tests of this kind, we suggest to pay attention to the following points: * Shear strength of soft solder depends on the deformation speed applied. The faster the material is deformed t
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