Electronics Forum | Mon Oct 08 02:12:21 EDT 2001 | george
I do not doubt about the power of the 552 and 580, but in some cases it may be overdone. For just a simple (straight forward) shear test, you can also look at: http://www.chatillon.com/products/dpp.html (�Low Capacity Mechanical Force Gauge. These er
Electronics Forum | Wed Jan 17 20:48:14 EST 2001 | davef
We find that the raw BGA's pad sheared surface has the SnPb solder at various Z heights whereas the assembled BGAs pad leave a smooth layer of SnPb along the pad. Like to understand the cause for the difference. Who could guess? Solder joint streng
Electronics Forum | Wed Sep 01 10:15:44 EDT 2010 | arjan
Dear Sachu_70, During the tests we also checkt other devices, there are a few small voids visible, but they are marginal. We only see large voids in this device. During the testruns we tried several reflow profiles, but without large succes.
Electronics Forum | Mon Aug 27 15:02:45 EDT 2001 | davef
It�s uncommon to test green strength. [Whatever �green strength� is. Some chip bonder adhesive suppliers have taken to taking about improvements in �green strength� their literature. We have asked sales types to quantify this and have never heard
Electronics Forum | Tue Jan 26 16:29:48 EST 2021 | charliedci
We will be exploring the exciting world of step stencils for the first time and I am looking for any advice from anyone using regularly. This direction is because we have large caps and soldered standoffs along with medium pitch LGA's and QFP's on sa
Electronics Forum | Fri Oct 01 16:17:10 EDT 1999 | Dave F
| I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Irons at
Electronics Forum | Fri Oct 05 16:05:58 EDT 2001 | seand
Hello everyone, Your chief variable here is going to be your epoxy. Different materials react accordingly to various inspection methods but, DEPENDING on your print parameters and material, you may be able to utilize an inline inspection machine.
Electronics Forum | Fri May 14 11:24:00 EDT 1999 | Chrys Shea
| Looking for a reasonably priced portable device to do strength test(shear/twist)on glue cured Cap/Res. Any suggestions? Thanks | My torque watch came from Waters Manufacturing, Inc. A div of Talley Industries. Longfellow Center, Wayland Mas
Electronics Forum | Fri May 14 12:13:55 EDT 1999 | P.L. Sorenson - Technical Consultant
| | Looking for a reasonably priced portable device to do strength test(shear/twist)on glue cured Cap/Res. Any suggestions? Thanks | | | My torque watch came from Waters Manufacturing, Inc. A div of Talley Industries. Longfellow Center, Wayla
Electronics Forum | Wed Nov 28 20:45:03 EST 2001 | dougk
We�ve also had glass diode difficulties- poor adhesion while all other parts are fine (including tall parts). I�ve received some interesting information from Heraeus: It seems the newer glues create a much stronger bond to SMD�s, except glass diodes.
