Electronics Forum | Wed Mar 12 17:53:52 EST 2003 | davef
O' Connor Haaa. It's usually the design guys that foist the problems onto my desk. Now that is one shrewd process type that you have working at your company!!!! Can I have his / her name and number to get some tips on the technique that he / she
Electronics Forum | Thu Feb 15 07:25:05 EST 2001 | Nick
0.5um(Ni~6.5um) after reflow(data taken in 48hrs).But after performing temperature cycle test ,the former aging rate(from the shear strength ) seems faster than the latter.Why!?Someone call this the 'precipitation hardness',but what actually is it! A
Electronics Forum | Thu Oct 13 15:34:55 EDT 2005 | Amol
Hi, We are in the process of transitioning to LF production. What are some of board materials being successfully used in production? Also, what surface finishes show promice of good results with SAC 305 solder? We are currently testing multiple boar
Electronics Forum | Thu Mar 31 19:41:36 EST 2005 | Dreamsniper
Can anyone guide me to what test do I need to be able to identify the strength of my fine pitch component solder joint? What value is available that I can use as a reference? Say 1.5 kg, 2.0 kg, 2.5 kg etc. I would like to have my fine pitch compone
Electronics Forum | Tue Jan 29 22:01:51 EST 2008 | davef
These test are largely useless. Check the fine SMTnet Archives for previous rants. Manufacturers of machines to use are: * Peel tests: Instron [Instron Worldwide Headquarters; 825 University Ave, Norwood, MA 02062-2643; 800 877 6674 http://www.inst
Electronics Forum | Wed Oct 06 03:18:01 EDT 2004 | Joseph
Dear all, Recently our customer complaint that some components being came off from the pcba after dropping test.But the curious is, the leads show visible solder fillet covering more than 75% of termination area on pad, which is acceptable as per IP
Electronics Forum | Wed Dec 15 19:31:26 EST 2004 | Thomas Denison
We have a ceramic BGA that the component supplier has misaligned the spheres in the fixture so they slant .007" out of alignment from the substrate pads. When the devices are tested at the component manufacturer this alignment issue also causes the
Electronics Forum | Tue Oct 09 20:40:48 EDT 2001 | davef
No one suggested that you speak for other suppliers and nor would they want� you �to speak for them." You shouldn�t make this something that it isn�t. All that was requested courteously was suggestions of alternate suppliers that could be considere
Electronics Forum | Wed Nov 15 12:52:21 EST 2017 | georgetruitt
IMO – Look into nano-coatings for your stencil and radius all square apertures This should help out with solder paste releasing from the stencil helping with insufficient solder QFN LGA aperture design, try a stencil cut with a few different apertur
Electronics Forum | Wed May 20 17:56:51 EDT 2009 | dyoungquist
I have attached a pdf showing the dimensions for the QFN we placed. First, The pins on the part are not only on the bottom side but also wrap around to come up each of the 4 sides of the part as shown in the side view in the attached pdf. This i
