Electronics Forum: lga shear test (Page 10 of 11)

Step by step guide in evaluation of Solder Bar and Flux

Electronics Forum | Mon Dec 11 20:44:37 EST 2006 | davef

Title : LEAD-FREE WAVE SOLDER FLUX EVALUATION Author : Michael Havener Author Company : Benchmark Electronics, Inc Date : 09/25/2005 Conference : SMTA International Abstract : The European Union�s deadline to ban lead in electronic pr

The glue with the holes...

Electronics Forum | Tue Oct 16 07:00:06 EDT 2001 | genglish

Hi all, I have a problem and would gratefully take on suggestions, firstly let me explain the situation: We are currently screen printing adhesive, using a method similar to DEKs 'Pump Print', The adhesive we are currently using is supplied from Alp

Gold plated PCB's

Electronics Forum | Sun May 05 22:18:20 EDT 2002 | ianchan

Hi mate, we had a crap experience (once...no more...) with gold plated over nickle (Au/Ni) PCB that had nickle contaminents in the PCB supplier's gold bath. the Ni caused batch-delivery of the PCB to us for mass production, to exhibit the visible s

Air inclusion in solder paste

Electronics Forum | Sun Mar 26 19:02:05 EST 2006 | ms

Hi We are running automatic stencil printers, open squeegees, stainless stencil, stainless blades, print speed 25-30mm/sec. We have a frustrating consistency issue printing .37x.3mm apertures on a 45pin LGA (11 pads each side, 1 large ground in mid

Re: Printing Adhesive

Electronics Forum | Thu May 06 09:24:06 EDT 1999 | Joe Manzur

Kevin, We are also looking at printing adhesive. Our application involves printing glue on the underside of the board, once it has gone through the dip, axial & radial process. In otherwords, there are leads cut and clinched and we have to mill out

Re: Help I need DATA on Thermal shock caused by REWORK!

Electronics Forum | Sat Oct 02 03:27:52 EDT 1999 | Brian

| I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Irons at

Re: Immersion Gold

Electronics Forum | Fri Oct 01 05:03:28 EDT 1999 | Wolfgang Busko

| | | I am having problems processing immersion gold boards. The achieved solder joints appear acceptable a la IPC-A-610, but the resultant joint does not fully cover the land, i.e. you can still see an outline of gold pad. | | | What is the best way

Re: SMT components Fall Off

Electronics Forum | Mon Jun 14 15:50:07 EDT 1999 | JohnW

| I am looking for more information about: | | 1) What kind of evaluation can I do to measure the resistance to fall off of a bottom side glueded SMT component?; | | 2) There is some influence of doble wave solder machine (temperature, flux, etc) i

Water wash flux and cleaning

Electronics Forum | Mon Jun 19 09:47:23 EDT 2017 | georgetruitt

You have a lot to think about! What does the flux manufacturer recommend as far as specifics like water temp or pressure? Do they recommend high temp di-water a detergent or saponifier? Do you currently have a cleaning machine, batch cleaner or inl

Re: all powerfull UP78..or is it..?

Electronics Forum | Wed May 05 10:57:25 EDT 1999 | Kevin Hussey

| | | Ok folk's has anyone used Alpha Metal's UP78 solder paste ? | | | | | | Our place is looking to move to that as the way to go, getting rid of the Hereaus 362's and Alpha 737's of the current set up. | | | | | | My question's are really : | |


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