Electronics Forum | Wed Aug 05 23:02:09 EDT 2009 | mrduckmann2000
Help! We are havin issues installing the new Linear Tech LGA118's. We are installing 17 of these beast per assembly, the problem shorting? Any ideas? Linear Tech is usless, they blame heat, not a big enough reflow oven, moisture, part disty's...e
Electronics Forum | Mon Aug 10 12:28:17 EDT 2009 | davef
We don't know dip about your Linear Tech LGA118, but we agree with published reports that say you should have between 4800 and 7000 thou^3 of paste on the pad for a LGA. These volumes were analyzed based on volumes found successful for CGA and then e
Electronics Forum | Tue Jul 27 06:34:14 EDT 2010 | bwet
Recently we have been placing and reworking quite a few Linear LGA DC converter modules. These are LGA packages with integrated passive components which become easily disturbed in reflow. Even with perfect bumping techniques on the LGA using the poly
Electronics Forum | Tue Aug 31 17:39:26 EDT 2010 | jeffjarmato
Follow the manufacturers reflow spec in the application guide.
Electronics Forum | Tue Aug 31 04:33:41 EDT 2010 | eyalg
We are facing 50% yield soldering Linerar (uModule) DC/DC LGA. The failure is characterized as "flactuation of output voltage." Can some one had the same failure?
Electronics Forum | Sat Jun 05 13:38:22 EDT 2021 | ppcbs
For Linear Tech LGA's we solder bump the LGA using a .30mm solder ball then reflow with a tacky flux. This will provide a void free solder joint and adds a little height to the solder joint in case you use a flux that you want to clean from under th
Electronics Forum | Wed Sep 01 05:09:27 EDT 2010 | grahamcooper22
Dear SMT Manufacturer, I am wondering if the device could have so much moisture in it and storing it in a dry cabinet isn't going to remove it all. As a final test to see if moisture in the device is causing the voids/solder balls then I'd bake it a
Electronics Forum | Mon Aug 30 06:47:18 EDT 2010 | arjan
We having issues installing the Linear Tech LTM8023. We have different soldering results in our PBfree testruns. The voiding and solderball rate is not stable (random positions and sizes). The pcb's (gold finish)are prebaked, the LGA's are stored in
Electronics Forum | Thu May 09 18:06:42 EDT 2002 | bcceng
janchan, don't know how many LGA's/LCC/BCC's you are placing but a short term solution that I can recommend is the application of solder bumps to the component and than place it after board has gone through reflow or even at the same time. Our compa
Electronics Forum | Tue Aug 11 15:19:41 EDT 2009 | aj
you gotta ask WHY? thankfully dont place these but I wud imagine you have referenced the datasheet for solder thickness etc. How is your placement? You say ypu place 17 of these? are you seeing shorts on all of them or a select few? aj
