Electronics Forum | Thu Sep 02 07:50:27 EDT 2010 | sachu_70
Just to add to my comments,solder joint voids do occur in LGA. Voids in LGA can be larger due to geometry and greater ratio of flux to solder. IPC-A-610D specifies a greater than 25% voided area is a defect for BGA, however, it does not specify the d
Electronics Forum | Mon Aug 10 12:28:17 EDT 2009 | davef
We don't know dip about your Linear Tech LGA118, but we agree with published reports that say you should have between 4800 and 7000 thou^3 of paste on the pad for a LGA. These volumes were analyzed based on volumes found successful for CGA and then e
Electronics Forum | Thu Sep 02 06:22:34 EDT 2010 | sachu_70
Good. This is the right way to profile. Let me ask you, have you anytime soldered QFN componets on your boards? The concept of LGA soldering is similar to that used for a QFN package. QFN soldering also exhibits void formations, and is an inherent pr
Electronics Forum | Thu Mar 19 11:31:14 EDT 2015 | duchoang
We remove the LGA, clean the pads, "re-ball" the LGA by solder-printing it, reflow and re-install it on board as BGA. That way, we don't need to apply solder paste on board. It works !!!
Electronics Forum | Sat Jun 05 13:38:22 EDT 2021 | ppcbs
For Linear Tech LGA's we solder bump the LGA using a .30mm solder ball then reflow with a tacky flux. This will provide a void free solder joint and adds a little height to the solder joint in case you use a flux that you want to clean from under th
Electronics Forum | Tue Aug 11 15:19:41 EDT 2009 | aj
you gotta ask WHY? thankfully dont place these but I wud imagine you have referenced the datasheet for solder thickness etc. How is your placement? You say ypu place 17 of these? are you seeing shorts on all of them or a select few? aj
Electronics Forum | Tue Mar 08 15:47:23 EST 2016 | sarason
Maybe your flux in the paste isn't working or simply isn't there in this new batch ? Heat a blob on the end of a soldering iron and smell it (head space analysis)(old chemist joke!) sarason
Electronics Forum | Tue Mar 08 15:55:08 EST 2016 | sarason
Also try monitoring your temperature profile with a temp sensor independent of the machine, maybe your heating element isn't spiking quite as well as it used to ? sarason
Electronics Forum | Fri Jun 04 11:38:47 EDT 2021 | bangir
Hi All, Do you have any experience for LGA component rework on SRT equipment? Please share how to re-soldering the LGA component to PCB pads. Thanks
Electronics Forum | Thu Sep 02 05:08:12 EDT 2010 | arjan
We drilled a hole in the centre of the LGA and put the thermocouple inside, so we measure the exact temperature between PCB and device.
