Electronics Forum | Sun Apr 11 11:39:52 EDT 2010 | manchella
When we have sent some of motherboards for reliability testing in a tird party laoratory. It is found that when Dye&Pry is done after 600 cycles of Thermal Cycling, in LGA socket only one of the corner solder joing had 100% type 3 crack. All other so
Electronics Forum | Thu Dec 12 10:00:44 EST 2019 | alexeyzb
Hello! 1) You can try to use solderbility tester (https://www.gen3systems.com/solderability-testing-must). 2) You can try to find more agressive solder paste. Some time ago we had the same problem. We gave some samples to our friends from another co
Electronics Forum | Wed Mar 02 05:01:41 EST 2005 | ABHI
Are your packages mounted on boar using sockets or BGA balls? LGA's are usually no issue and are simple compared to BGA. No issue on missing balls or ball drop issues. However, LGA's need quite a bit of mounting / holding pressures during test and mo
Electronics Forum | Fri Sep 03 06:53:38 EDT 2010 | arjan
Yes, we assembled a lot of QFN in the last years, but we don't have a X-ray machine by ourself, so we cant't inspect each device. This type LGA was designed on a prototyping board of our customer so we would validate our LGA reflow process and a rese
Electronics Forum | Thu May 16 22:37:22 EDT 2002 | xzinxzin
anyone experience to solve the non-wetting on Microleadframe packages component terminal sides. 1)I test the components solderbility in dip and look test, in solder pot at 240 deg C,the wetting on the sides is ok. but I run on mass production in refl
Electronics Forum | Thu Mar 13 01:42:58 EDT 2008 | Sean
Thanks Real Chunks and Davef...Yours input is valuable to me. My inputs towards your question asked below: Questions are: * Why did you tell us the following? "This BGA is installed with heatsink (with hook at both side of the heat sink) manually b
Electronics Forum | Fri Sep 08 09:16:37 EDT 2006 | james
We are incurring problems with Film Chip Capacitors with reflow issues. Some of the parts are misaligning or not soldering on one end (almost tombstoning) . We left the parts in the dry cabinet till they were used. We tried both reflow ovens (hell
Electronics Forum | Wed Sep 01 10:15:44 EDT 2010 | arjan
Dear Sachu_70, During the tests we also checkt other devices, there are a few small voids visible, but they are marginal. We only see large voids in this device. During the testruns we tried several reflow profiles, but without large succes.
Electronics Forum | Tue Jan 26 16:29:48 EST 2021 | charliedci
We will be exploring the exciting world of step stencils for the first time and I am looking for any advice from anyone using regularly. This direction is because we have large caps and soldered standoffs along with medium pitch LGA's and QFP's on sa
Electronics Forum | Tue Jul 02 02:50:55 EDT 2002 | ianchan
Hi mates, was going thru the IPC-A-610C Standards, and noted BGA voids stands somewhere between 10%-25% voids permissible in the solder "ball" bump, after reflow process. Was wondering, hypothetical case study, is there any specification for voids
