Electronics Forum: lift components issue (Page 1 of 190)

Tombstone components issue after reflow?

Electronics Forum | Sat Aug 12 02:52:16 EDT 2017 | tsvetan

There is no solution in above case, this is caused by the PCB design. There are no thermals on the pads connected to the copper poured area. So the other pad reflow first and lift the component.

Tombstone components issue after reflow?

Electronics Forum | Fri Aug 11 22:50:57 EDT 2017 | heros_electronics

Anyone who knows how to prevent such flaw? Tombstones are those lifted components from one sides. This results in costly and time-consuming amounts of touch-up and re-work after the assembly is completed. For the customers, this extra work translate

Tombstone components issue after reflow?

Electronics Forum | Mon Aug 14 03:25:51 EDT 2017 | spoiltforchoice

There is no solution in above case, this is > caused by the PCB design. There are no > thermals on the pads connected to the copper > poured area. So the other pad reflow first and > lift the component. Yes, this. You could try playing with

Tombstone components issue after reflow?

Electronics Forum | Sun Aug 13 22:26:01 EDT 2017 | dawson

Anyone who knows how to prevent such > flaw? > > Tombstones are those lifted components > from one sides. This results in costly and > time-consuming amounts of touch-up and re-work > after the assembly is completed. For the > customers, this e

SIPLACE D1i SOT(SMT Transistor lead lift up detection)

Electronics Forum | Thu Mar 03 03:54:38 EST 2022 | gary_sastrillas

The only way can detect, play around with your vision teaching with the component. and adjust the pin tolerance.

SIPLACE D1i SOT(SMT Transistor lead lift up detection)

Electronics Forum | Tue Mar 01 04:25:48 EST 2022 | shrikant_borkar

Dear Members Please help me to support to one of my client does not have co planarity in his SIPLACE D1i Pick and place machine. We would like to understand why this Lead lift up issue has passed thru pick and place.? Is there any method by keepin

Tombstone components issue after reflow?

Electronics Forum | Mon Aug 14 14:27:56 EDT 2017 | emeto

God I hate the formatting of my post!

Tombstone components issue after reflow?

Electronics Forum | Thu Aug 17 12:59:36 EDT 2017 | horchak

There is DFM Design for Manufacturing, but now I see DFF Design for Failure. Start over.

Tombstone components issue after reflow?

Electronics Forum | Thu Aug 17 12:18:40 EDT 2017 | cyber_wolf

I do not see anything obvious that would cause a thermal mis match. Regarding reflow profiles reducing tombstoning, Unless there is something wrong with your paste or you are running smaller than 0402's, I have NEVER seen a reflow profile reduce tom

Tombstone components issue after reflow?

Electronics Forum | Wed Aug 16 14:36:06 EDT 2017 | duchoang

Not enough solderpaste. Uneven solderpaste volume on pads. Bad quality of caps ( Metal ends), try new cap manufacturer, sound weird, huh!! but that happened to me. Good luck.

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