Electronics Forum | Wed Dec 04 10:59:04 EST 2019 | dwl
The solder looks a little grainy for Sn/Pb solder but that might just be the picture quality. There appears to be plenty of solder on the pads, so I'd rule out anything to do with the stencil. One possibility that springs to mind; how long is your
Electronics Forum | Wed Sep 29 05:30:59 EDT 2010 | patejl
Hi We have a problem here in the company with AOI system, most of the problem is lifted lead on qfp components.We are using SAKI BF-planet-x. Most of the defects like mising components 603 or 402 are no problem but if it comes to lifted lead even
Electronics Forum | Wed Nov 13 21:16:28 EST 2002 | Vinny
Hi All, I am producing a lot of high cost PCBA where the pCB material is the `ROGER' material. Due to some of the high components and handling we get pad lifted issues sometimes and as of now are unable to do repairs on these. Please help if anybo
Electronics Forum | Wed Jan 19 11:52:34 EST 2000 | Dave F
PC and Erico: Are yinns talking: 1 A component that will not lie flat on the board? 2 A component that will lie flat to the board that you can't get to solder to the pad? 3 A pad that is no longer attached to the board? 4 Something else. Whazit?
Electronics Forum | Thu Jan 20 02:36:29 EST 2000 | erico
Hi wolfgang,Dave & PC: What I facing are: 1. The component lie flat on the board but only one side can get solder.The pad is ok, problem is with the chip. 2.I desolder the chip and go to view it under microscope and found that there is a line near t
Electronics Forum | Thu Jan 20 11:20:28 EST 2000 | Brian W.
It sounds like what you are seeing is leaching of the end cap. You need to check the manufacturer's spec. Many components have terminal barriers, which get a solder plating. Sometimes this plating process is not done well, and the solder plating le
Electronics Forum | Wed Jan 19 08:40:53 EST 2000 | Wolfgang Busko
Hi Erico, I think it�s just a naming problem. Under the topic of tombstone there are a lot of causes for different appearances of this symptom. Shouldn�t be always the errected position that occurs. In your case it seems that either the components so
Electronics Forum | Sat Apr 04 08:35:27 EDT 2009 | davef
Cause: Solder between the pad and the BGA on the pads being lifted has not melted. So, when you lift the BGA, you also lift those pads with the unmelted solder with the BGA. These pads are probably sinking the heat to a large copper plane in a inner
Electronics Forum | Fri May 28 16:30:39 EDT 1999 | JohnW
| Yes l know this problem keeps cropping up on the forum but l've missed some of the follow-ups. | | Our problem is that the lifting only occurs on 3% of production so actually detecting an improvement is difficult. We're actually having to inspect
Electronics Forum | Wed Apr 08 15:16:14 EDT 2009 | waveroom
I would use almost the same profile you use when putting the component down on the board. Your pre-heat is essential in rework. Also even though your machine tells you your at a specific temperature I would add a thermocouple next to the component yo
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