Electronics Forum | Fri Jan 22 10:17:47 EST 1999 | LeeAnne
I have boards coated with Humiseal 1B73. At a late point mfg. site we need to remove a series of 0603 resistors for optioning purposes. I have been trying to determine the fastest, easiest way to re-coat the pads after removal. Drying time of the coa
Electronics Forum | Tue Dec 03 18:51:57 EST 2019 | kylehunter
Hi all, We are having a confusing defect with one of our client's boards. It is a large board, 30" x 12". The client supplies the LEDs, they are cheap overseas diodes, and it is not uncommon to have reels with the packaging torn. We have w
Electronics Forum | Fri Jan 22 14:31:14 EST 1999 | Dave F
| I have boards coated with Humiseal 1B73. At a late point mfg. site we need to remove a series of 0603 resistors for optioning purposes. I have been trying to determine the fastest, easiest way to re-coat the pads after removal. Drying time of the c
Electronics Forum | Sat Jan 23 07:08:54 EST 1999 | Graham Naisbitt
| I have boards coated with Humiseal 1B73. At a late point mfg. site we need to remove a series of 0603 resistors for optioning purposes. I have been trying to determine the fastest, easiest way to re-coat the pads after removal. Drying time of the c
Electronics Forum | Wed Jan 27 09:00:56 EST 1999 | Chris Fontaine
| | I have boards coated with Humiseal 1B73. At a late point mfg. site we need to remove a series of 0603 resistors for optioning purposes. I have been trying to determine the fastest, easiest way to re-coat the pads after removal. Drying time of the
Electronics Forum | Thu Apr 09 07:37:18 EDT 2009 | fowlerchang
Another suggestion for it. Baking the whole boards before rework the BGA. It is not only benifit to the BGA but also to the pad.
Electronics Forum | Fri Apr 03 15:30:10 EDT 2009 | ed_faranda
I have a VJE Summit 750 Rework machine... I don't think that matters much, but I put it out there anyway. I am removing a BGA (29mm x 29mm) off a board, but some of the pads on the board are being lifted during the process. Does someone have any
Electronics Forum | Sat Apr 04 08:35:27 EDT 2009 | davef
Cause: Solder between the pad and the BGA on the pads being lifted has not melted. So, when you lift the BGA, you also lift those pads with the unmelted solder with the BGA. These pads are probably sinking the heat to a large copper plane in a inner
Electronics Forum | Thu Apr 09 09:23:29 EDT 2009 | ed_faranda
Well, I did manage to solve this problem. I lowered the max boards temp from 245 to 235. Then I decreased my TAL. This seemed to work perfectly. Thanks everyone for your suggestions! They got me in the right direction.
Electronics Forum | Mon Apr 06 11:46:10 EDT 2009 | c111
I agree the longer soak will help provided you are not applying to much heat/time to the board now. -are the pads that lift connected to anything? This has happened to me in the past where un-connected pads would come of far easier than those connec
