Electronics Forum | Tue May 01 13:25:20 EDT 2001 | kaoni
Thank you Wolfgang, My time table is the amount of time it takes to get it right. I hope to have product by next December if possible. Yes, I am starting from ground zero. I need to go 201 because of the size limitations as to what I need to fit in
Electronics Forum | Tue Dec 14 22:17:33 EST 1999 | Dave F
Armin: How ya doin� bud? CK gives good advice, but I'd like to take a bit of a different angle. Q1. For 0.7 mm (0.027in) diameter hole for vias, what�s the minimum annular ring for this hole diameter? Depends on what you�re trying to do. For in
Electronics Forum | Mon Feb 18 09:38:30 EST 2002 | davef
Excuse me seeming to parrot Wolfgang�s posting, but he makes good points and I'd like to expand on them. I disagree that it's about disliking a "non-techie to post a reply/comment to the SMTNet forums." It's not about WHO posts. It's about WHAT i
Electronics Forum | Sat Oct 09 10:30:24 EDT 1999 | bix
| | | | | Can anyone tell me the formula/method to determine | | | | | the amount of weight that solder's surface tension can support. | | | | | (ie: Maximum weight of components soldered onto a bottom side | | | | | of a board during a top side refl
Electronics Forum | Mon Oct 11 12:49:11 EDT 1999 | John Thorup
| | | | | | Can anyone tell me the formula/method to determine | | | | | | the amount of weight that solder's surface tension can support. | | | | | | (ie: Maximum weight of components soldered onto a bottom side | | | | | | of a board during a top s
Electronics Forum | Tue Oct 12 05:09:13 EDT 1999 | Brian
| | | | | | | Can anyone tell me the formula/method to determine | | | | | | | the amount of weight that solder's surface tension can support. | | | | | | | (ie: Maximum weight of components soldered onto a bottom side | | | | | | | of a board during
Electronics Forum | Fri Aug 13 09:51:25 EDT 1999 | Dave F
| Ladies and Gentlemen, | | As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally follows I would hav tremendous
Electronics Forum | Fri Aug 13 13:00:08 EDT 1999 | Earl Moon
| | | Ladies and Gentlemen, | | | | | | As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally follows I would hav
Electronics Forum | Fri Aug 13 13:25:09 EDT 1999 | ScottM
| | | | Ladies and Gentlemen, | | | | | | | | As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally follows I wou
Electronics Forum | Wed Jul 28 16:36:30 EDT 1999 | Earl Moon
| | | While inspecting incoming PCBs we detected around all plated-through-holes (only there and all in the same place) some halfmoonshaped light rings that match obviously only with the pink ring symptom shown in the IPC-A-600 chapter 2.5.2.. That w
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