Electronics Forum | Thu Aug 21 08:15:07 EDT 2008 | naynayno
Thanks Dave, I will be sticking with Manufacturing Engineering. These are good guidelines but what is standard clearance for various packages? This is a dimension we usually seek by eye, whether we will have a problem or not. We use straight DI -
Electronics Forum | Fri May 27 14:37:05 EDT 2005 | Frank
Look into the Juki KE-2060E machine. I have been extremely pleased with this machine. It will hold 80-8mm feeders, place 0201 (0603-metric) up to 74mm square ICs and BGA, 150mm long connectors. Up to 25mm tall components. It can handle up to 30 t
Electronics Forum | Thu Jun 02 18:16:26 EDT 2005 | URI
Look into the Juki KE-2060E machine. I have been > extremely pleased with this machine. It will > hold 80-8mm feeders, place 0201 (0603-metric) up > to 74mm square ICs and BGA, 150mm long > connectors. Up to 25mm tall components. It can > ha
Electronics Forum | Mon Jun 22 06:35:19 EDT 2020 | vinitverma
Sapphire has a Line Array camera on either side. So all components on all nozzles are recognised in a single pass. But Sapphires are tough to maintain. And yes, it can handle max. 25x25mm components with the Line Array.
Electronics Forum | Fri Apr 20 11:07:52 EDT 2001 | kawiederhold
Hi Dave, Good to "talk" to ya again!! I have attached a photo of the antenna. Hopefully it will work its way through the system. The pictured antenna meets all our criteria. The defective antennae all seem to slide toward the center of the PCB (
Electronics Forum | Wed May 14 15:15:03 EDT 2008 | boardhouse
Hi Scott, I have worked for a State side PCB Manufacture and now a Taiwan Manufacture. At both shops the up charge was based on how many up the pallet array was plus layer count and complexity of product, charges ranged from free to 15%. Standa
Electronics Forum | Mon Oct 18 20:06:27 EDT 1999 | Phuc Nguyen
I am researching a process call Collumn Grid Array for the BGA. Please email me if you have some knowledge about this process. The problem is ceramic BGA has different thermal coefficient with PCB (FR-4) material, and in extreme temperature (-40 C-
Electronics Forum | Mon Mar 27 20:59:41 EST 2000 | Dave F
Garo: Voids are primarily process indicators. There is experimental evidence that voids retard crack propagation locally around the void on a temporary basis. There is no standard, IPC or otherwise, on voids--nor should there be. See also J-STD-013,
Electronics Forum | Tue Feb 04 14:05:10 EST 2003 | bradlanger
I am haveing some trouble with ceramic capacitors breaking on a couple of boards I am running. The boards I have trouble with are in a 6 up and 12 up array and the caps are near the score lines where the individual boards are broken apart. Has anybod
Electronics Forum | Fri Oct 12 11:18:57 EDT 2012 | srgbarba
Hi, I want to ask if someone saw the combo process at smt lines for panel array (bot & top per both sides), I just perform some experiments and it works perfectly, and I validate the T hus (Cg/Pa) and no one component were dropped after the 2nd reflo
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