Electronics Forum | Mon Jun 05 12:30:24 EDT 2017 | deanm
Mike, The dispensable solder paste is ordered separately from the printed paste because it has a higher flux content. I would not feel comfortable mixing liquid flux into the printable paste. Ask your paste vendor if they have a dispensable version.
Electronics Forum | Wed Feb 13 13:32:15 EST 2002 | caldon
Liquid Control Corp May be able to intergrate a unit like you speak of. Contact Geoffrey Silver at : 215-918-0872 or silver@liquidcontrol.com. Best regards, Cal
Electronics Forum | Tue Sep 08 16:35:17 EDT 2015 | duso02
There are many liquid masking manufacturers. Some even use acrylic vice latex. Try Contronic Devices. They make their mask in multiple viscosities depending on how you will apply it and where.
Electronics Forum | Thu Sep 15 10:43:18 EDT 2016 | claudea2
Thanks to Bobpan we re connected our wipe system and all the air actuators work fine. I still have a problem with the cleaner fluid dispenser. It is not moving as it should to dispense the liquid when we do the command. I suspect the values in the c
Electronics Forum | Mon Jun 13 01:31:36 EDT 2005 | buchi79
Devef, The stand off height is 75micron. We only clean the product after underfill process. Dispense epoxy under the FC & cure it before aqueous wash. Samples are sent for LPC (liquid particle count) Test to ensure cleaniness. By the way, our plant
Electronics Forum | Mon Aug 17 02:50:44 EDT 1998 | Bob Willis
| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple
Electronics Forum | Fri Nov 09 07:29:02 EST 2001 | henriksn
Hi, I would just like to add, that in our prototype production we often mount doublesided pcb's with components ranging from 0402 to BGA-280 to QFP-100. Of course we also mount and solder the side with the BGA's and QFP's last. Like the others here,
Electronics Forum | Tue Aug 13 10:26:05 EDT 2002 | lloyd
I am currently running several SMT lines that are placing components onto dispensed adhesive (Heraeus PD 944). My problem is that we have always had an issue with a resin type liquid �condensing� on the inside of our oven chimney and then running bac
Electronics Forum | Thu Aug 13 10:58:58 EDT 2009 | davef
First piece of advice: build the board as you would any other board. Probably, you will be surprised at the holding force of the solder of the connections of the BGA, because the surface area of the solder is very large compared to the weight of the
Electronics Forum | Wed Feb 10 08:10:26 EST 2010 | davef
Here is a posting by P Kinner at Humiseal ... Typically, there are three main approaches to avoid coating wicking into press-fit connectors (and other keep out areas). Wicking is a phenomenon caused by a combination of low viscosity of conformal coa
