Electronics Forum: liquid dispenser (Page 2 of 4)

Latex Masking Dispense Valve

Electronics Forum | Tue Sep 08 16:35:17 EDT 2015 | duso02

There are many liquid masking manufacturers. Some even use acrylic vice latex. Try Contronic Devices. They make their mask in multiple viscosities depending on how you will apply it and where.

Ekra E4 stencil wipe problem

Electronics Forum | Thu Sep 15 10:43:18 EDT 2016 | claudea2

Thanks to Bobpan we re connected our wipe system and all the air actuators work fine. I still have a problem with the cleaner fluid dispenser. It is not moving as it should to dispense the liquid when we do the command. I suspect the values in the c

Solder Paste Flux %

Electronics Forum | Mon Jun 13 01:31:36 EDT 2005 | buchi79

Devef, The stand off height is 75micron. We only clean the product after underfill process. Dispense epoxy under the FC & cure it before aqueous wash. Samples are sent for LPC (liquid particle count) Test to ensure cleaniness. By the way, our plant

Re: BGA Repair Problems

Electronics Forum | Mon Aug 17 02:50:44 EDT 1998 | Bob Willis

| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple

Reflow X2

Electronics Forum | Fri Nov 09 07:29:02 EST 2001 | henriksn

Hi, I would just like to add, that in our prototype production we often mount doublesided pcb's with components ranging from 0402 to BGA-280 to QFP-100. Of course we also mount and solder the side with the BGA's and QFP's last. Like the others here,

oven resin from adhesives

Electronics Forum | Tue Aug 13 10:26:05 EDT 2002 | lloyd

I am currently running several SMT lines that are placing components onto dispensed adhesive (Heraeus PD 944). My problem is that we have always had an issue with a resin type liquid �condensing� on the inside of our oven chimney and then running bac

Double sided BGA assembly

Electronics Forum | Thu Aug 13 10:58:58 EDT 2009 | davef

First piece of advice: build the board as you would any other board. Probably, you will be surprised at the holding force of the solder of the connections of the BGA, because the surface area of the solder is very large compared to the weight of the

humiseal 1b73 wicking

Electronics Forum | Wed Feb 10 08:10:26 EST 2010 | davef

Here is a posting by P Kinner at Humiseal ... Typically, there are three main approaches to avoid coating wicking into press-fit connectors (and other keep out areas). Wicking is a phenomenon caused by a combination of low viscosity of conformal coa

Conformal Coating

Electronics Forum | Tue Nov 01 10:06:00 EDT 2011 | davef

Humiseal says: Typically, there are three main approaches to avoid coating wicking into press-fit connectors (and other keep out areas). Wicking is a phenomenon caused by a combination of low viscosity of conformal coating material and strong capilla

Re: Conformal Coating on Circuit Boards

Electronics Forum | Sat Jan 29 13:06:18 EST 2000 | Graham Naisbitt

Todd, All liquid coatings are Newtonian - they follow gravity so they do indeed run away from sharp leads and edges. Silicones are generally worse because they have very low surface energy - although this is an asset when trying to get under compone


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