Electronics Forum | Tue Aug 22 21:00:39 EDT 2006 | davef
National says: [ http://www.national.com/packaging/llp/faq.html#faq_manu ] Manufacturing FAQ's Are there any precautions that need to be taken with the LLP package? It is critical to follow National�s guidelines for successful surface moun
Electronics Forum | Wed Jun 18 16:03:03 EDT 2003 | mkehoe
Orrrrr, just buy a small reflow oven, 5K to 7K, and eliminate the paste printing by using solid solder deposition. No shorts, no opens, no cleaning, and no voids. www.sipad.com If you decide to print your own paste later you can invest the extra 30
Electronics Forum | Fri Dec 22 16:04:26 EST 2006 | mika
Hi, This Not so easy as one wuold think. Has the thermal pad of yours vias? How many? What's the via's dia? What is the pcb thickness? If the the pcb has a "ground layer" connected (vias) to the pcb thermal pad, it could sometimes be a little bit tri
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