Electronics Forum | Fri May 12 10:26:28 EDT 2017 | capse
I'm the Rep for KOKI in the southeast. They offer solder paste with a type R flux. You can call Shantanu Joshi (760-504-2544) for details.
Electronics Forum | Tue Apr 13 14:14:59 EDT 2004 | russ
I have actually printed this same condition with type 3 paste Alpha WS709. I posted this for discussion and cannot remember what I called it. We did need to clean the stencil after every three prints. I did not check volume on these locations but
Electronics Forum | Thu Feb 24 21:47:22 EST 2000 | Dave F
Interesting, Gary. Try this: 1 Assess candidate solders by reviewing J-STD-006 (http://canfieldmetals.com/j-std006.htm) to determine solder formulations that have liquidous temperatures in the desired range. 2 Request recommended profiles from supp
Electronics Forum | Thu Feb 24 21:47:22 EST 2000 | Dave F
Interesting, Gary. Try this: 1 Assess candidate solders by reviewing J-STD-006 (http://canfieldmetals.com/j-std006.htm) to determine solder formulations that have liquidous temperatures in the desired range. 2 Request recommended profiles from supp
Electronics Forum | Fri Dec 17 09:48:50 EST 2004 | grayman
I agree with dave. However, if you can not afford those expensive cartidges, you start putting enough solder paste on the stencil so to minimize waste. I agree you have to dispose of the excess dried up solder but if your process is not very critical
Electronics Forum | Thu Apr 15 10:05:26 EDT 2010 | davef
Why not use the same paste volume as you currently use? Alternately, although we haven't used it in a while, doesn't IPC have a very nice paste volume, aperture calculator that could be used for this? Or is it just a pad size calculator used for
Electronics Forum | Fri Jan 28 04:03:51 EST 2011 | grahamcooper22
Print then dispense in the areas you need extra paste. Why can you not use a stencil which has areas etched away around component patterns to thin the stencil down....for example a 150 micron thick stencil etched to 120 or 100 microns in specific are
Electronics Forum | Tue Feb 17 01:12:52 EST 1998 | J.H. Kim
In solder bumping in flipchip technology by splder printing, the precise control of solder volume and height is very difficult. Therefore I'd like to know the solution of this problem. Thanks
Electronics Forum | Tue Apr 13 14:56:51 EDT 2004 | russ
in a thread titled ".5mm bga" there is a reference to a paste by alpha that is no-clean and is supposed to be made specifically for this situation. I suppose that increasing the pad dimension to .012" is out of the question? Russ
Electronics Forum | Fri Dec 17 10:24:23 EST 2004 | rlackey
Hi Matt, What printer are you using? you may be able to get an envronmental unit for it to keep the paste cooler & at the right humidity for longer, thus extending it's effective window. Cheers, Rob.
