Electronics Forum | Tue Apr 12 08:25:43 EDT 2005 | davef
Q1 Can anyone explain to me what is the clean and non clean solder? A1 The trend away from CFCs has lead many users to evaluate switching to no-clean soldering processes. The term "no-clean" is actually a common misnomer when used to describe a flux
Electronics Forum | Tue Apr 12 04:37:52 EDT 2005 | chandran
1.Can anyone explain to me what is the clean and non clean solder? 2.What is the standard solder paste height spec for stencils 4mils,5mils and 6mils? 3.Whatis the meaning for ROHS?
Electronics Forum | Wed Dec 09 09:47:32 EST 2009 | dyoungquist
I am curious as to why you need to mix.... We use a 500g cartridge with air gun. Our process is remove the cartridge from the fridge, allow it to warm up to room temperature before inserting into air gun, then apply bead of paste to the stencil. N
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
Electronics Forum | Tue Apr 13 08:07:53 EDT 2004 | Frank
Hey, What implications are there when cleaning a stencil of conductive adhesives rather than solder paste? I'm looking to change over to this medium but i'm stuggling to find any journals or data based around the implications of this transision, Ch
Electronics Forum | Tue Apr 13 19:47:05 EDT 2004 | davef
Glue has different mechanical, thermal, and electrical properties than solder. That's why all these very nice no-lead people are furiously trying to gin-up some wacky solder alloy, rather than using glue. Among the papers in the SMTA Knowledge base
Electronics Forum | Wed Jun 14 21:49:42 EDT 2006 | davef
Bryan: * Most of our stencils are made from stainless steel that is held by a aluminum frame, attached with epoxy with a fiber glass intermediary between the frame and the stencil. * We use stencils to print either glue [thermoset epoxy] or solder pa
Electronics Forum | Fri Oct 14 14:09:19 EDT 2005 | bschreiber
Your problem is not the 0.4 pitch. Your problem is the manual cleaning. Manual cleaning will only remove the solder paste from the surface of the stencil. What's more, manual cleaning will force additional contamination into the 0.4 pitch apertures
Electronics Forum | Mon Jun 19 17:00:39 EDT 2006 | a_laser
The most common rates of in-process cleaning (under wipe) I have encountered are once per 5 to 10 prints. But this depends a on a lot of variables. More often is typically better, but more costly in under-wipe materials. (For some more info see http:
Electronics Forum | Wed Mar 21 18:32:45 EST 2001 | Steve
The design engineers I work with are blaming some circuit problems on what they think might be related to the no-clean flux residue. (It couldn't be the design.) Has any body else seen noise issues in high speed circuits related to no-clean flux resi
