Electronics Forum | Thu Jul 29 00:42:32 EDT 2004 | C.W
hello, BGA was a little excessively reflowed with dwell time(above 183C - solder paste = 63/37) over 2 min, peak temp is 218C. I inspected the BGA under X-ray and there is a little voids but within the acceptable range, i then used the Ersascope to c
Electronics Forum | Fri Jul 30 17:20:09 EDT 2004 | Francois Monette
A couple of other potential issues are moisture/reflow related issues. This can include internal delaminations inside the component, potentially breaking or lifting the wirebonds. It may also induce warpage where the corners of the BGA will curl up.
Electronics Forum | Thu Aug 26 13:34:05 EDT 2004 | gregp
Yes, Rob, the database can be output to a text file. But you do not need to create new labels because the correct information is in the database. The original label on the reel contains the reel's unique ID which correlates to the database (the info
Electronics Forum | Tue Sep 07 06:32:32 EDT 2004 | C Lampron
Dhanashekar, Yes this is an important proces control tool. This will show if you printer setup is correct however, I put more importance on coverage. If your paste height is 1 mil shorter than it should be, you may need to look at your printer setup
Electronics Forum | Fri Dec 03 13:08:40 EST 2004 | Dreamsniper
The voids are between the interface of the pad and the solder joint of component chips. I have a good thermal profile and this problem occured only on certain product so since we have some common components, component termination contamination is no
Electronics Forum | Mon Jan 10 16:14:17 EST 2005 | fmonette
Hi Gary, With plastic BGAs it is more difficult to remove the trapped moisture because of ground planes in the substrate. If your parts have been sitting around for a long time they may be soaked with moisture and in some cases the 48 hours bake cy
Electronics Forum | Sun Feb 20 21:17:58 EST 2005 | dlkearns1
HI Brad, I'd stick with QUAD, I believe they are no longer known as quad. It's what you know, a different brand would mean learning it and the time to do so. I've never seen any problem with QUAD, that could not be resolved. The C series is kinda ol
Electronics Forum | Wed Mar 09 08:23:31 EST 2005 | davef
We don't have experience on this, but first we'd talk to a technical type at our solder paste supplier. Baring that, we'd: * Soak a paper towel in a 'solvent' [ie Kyzen XJN, EnviroSense Enviro Gold, Petroferm Hydrex, etc]. * Place the towel in conta
Electronics Forum | Mon Apr 18 12:28:33 EDT 2005 | davef
We've never heard of it either. Stained glass widow people use varous types of copper and brass tape / foil in their work. A widely used suppler of this tape is Venture [ http://www.venturetape.com ]. They may be able to help. We're not sure how
Electronics Forum | Tue May 24 19:35:36 EDT 2005 | davef
Certainly, most often, the focus of pot analysis is directed at controlling impurities. Maintaining proper level of tin is important, also. When the portion of tin decreases: * Liquidous temperature increases. * Ability to wet decreases. * Solder c
