Electronics Forum: longer (Page 75 of 116)

New to SMT Equipment

Electronics Forum | Wed Sep 17 12:51:04 EDT 2008 | stepheniii

We got over 500,000 placements per month with two Mydatas for three consecutive months. And I want to say organized Fuji changeovers beat disorganized mydata changeovers. Even though Daxman is right that they can take a little longer to set up. In o

NiPdAu Soldering Problems?

Electronics Forum | Fri Sep 19 21:31:15 EDT 2008 | trynders

Thanks for the response guys! The parts are being sent to a local lab as we speak. I'll let you know the results when I get them. I am not sure the purpose of the copper band, but the black around the band is just shadowing from how I took the pi

Dealing with TH Barrels on Bds w/Heavy Ground Planes

Electronics Forum | Thu Oct 16 11:15:53 EDT 2008 | davef

A good solder connection with heavy ground plane requires: * Plenty of heat [Is the preheater located too far from the wave? Whenever you look at board temperature, there is a sharp decrease in temperature between the preheater and the wave.] * Conta

Graphite/Carbon deposit on PWB ( any Industrial Specs?)

Electronics Forum | Fri Mar 13 11:55:23 EDT 2009 | boardhouse

Hi GSX, just and FYI on why you are seeing a difference per lots. Carbon Ink is Not used on a steady bases by most manufactures, and shelf life of the Carbon ink is fairly short, my guess is what they are doing is adding thinner to the carbon ink t

Sn100C - anyone use this at Reflow?

Electronics Forum | Wed Mar 18 16:50:20 EDT 2009 | khowell

There are many users of SN100C in reflow. SN100C was originally introduced as a wave solder alloy which offered cost savings over SAC, no solder pot erosion, and high fluidity. Since it is eutectic, no plastic range, the joints have a smooth, shiny

intermetallic question

Electronics Forum | Sat Apr 11 09:56:31 EDT 2009 | davef

You're correct. You should expect to see an intermetallic layer in a proper solder connection. Try leaving the component at temperature for a longer period. Growth of intermetallic compounds on Cu surfaces [Klein Wassink]: d = 10^3(exp(-5*10^3/T)t^1

AOI 2009 MIRTEC MV-7xi 5 MP or Yes tech YTV-FX 5MP

Electronics Forum | Mon Dec 07 09:49:00 EST 2009 | oeidave

Dany, Thank you for posting your question. At Omron Electronics, we believe, and consistently are proven to be the leaders in Solder Joint inspection. We have been manufacturing AOI systems longer than any other company in the market and are often i

Rohs Solder paste re-evaluation

Electronics Forum | Fri Feb 05 14:39:50 EST 2010 | gregcr

Hi All, We evaluated and approved KESTER R520A for our default RoHS solder paste a couple years back. It's time to re-evaluate to see if this material is still the best choice. Please let me know your opinion on the solder paste you are using, and

Selective Solder Equipment

Electronics Forum | Tue Mar 23 15:46:28 EDT 2010 | pilusa

The AIM flux is for the process and not for the tip tinning. The flux I was referring to is what is used to keep the tip wetted which was one of your original problems. Regarding the process, in my experience the AIM flux is not very active and there

smd led storage

Electronics Forum | Fri Mar 19 03:50:37 EDT 2010 | grahamcooper22

Some things you have to be sure of... Can you guarantee the LEDS are DRY when you receive them ? They may be packed in dry bags but when was this done and has the LED distributor had them open at his site ? Using vacuum sealed dry packs is a good way


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