Electronics Forum | Fri Feb 05 14:39:50 EST 2010 | gregcr
Hi All, We evaluated and approved KESTER R520A for our default RoHS solder paste a couple years back. It's time to re-evaluate to see if this material is still the best choice. Please let me know your opinion on the solder paste you are using, and
Electronics Forum | Tue Mar 23 15:46:28 EDT 2010 | pilusa
The AIM flux is for the process and not for the tip tinning. The flux I was referring to is what is used to keep the tip wetted which was one of your original problems. Regarding the process, in my experience the AIM flux is not very active and there
Electronics Forum | Fri Mar 19 03:50:37 EDT 2010 | grahamcooper22
Some things you have to be sure of... Can you guarantee the LEDS are DRY when you receive them ? They may be packed in dry bags but when was this done and has the LED distributor had them open at his site ? Using vacuum sealed dry packs is a good way
Electronics Forum | Fri Jun 18 05:36:55 EDT 2010 | elsey1987
Dear all friends, our company want to import JUKI SMT pick&placement machine to China,However, I really did not understand two recent clients,When I say their prices are higher,one of them replied to me:all of your first replies are always the same.
Electronics Forum | Mon Oct 18 11:43:42 EDT 2010 | hegemon
Use the forums nice search feature above. "Lead Free BGA" Lots of info. In short it seems the general consensus is that you are pretty much safe using your lead free BGA in a tin lead process, provided you run your peaks a little higher, and your
Electronics Forum | Thu Jan 27 04:02:00 EST 2011 | richiereilly1
Hi, We had a similar issue to this. When we examined the boards at x-ray there were no apparent defects, We sent the boards for Dye and pry testing and we found that there were crack or gaps between the paste on the PCB and the BGA ball. basically th
Electronics Forum | Wed Jun 08 13:41:56 EDT 2011 | swag
Two thoughts from me: 1)Are you sure the balls are collapsed? Have you looked at the perimeter from the side with a scope? From your x-ray, it appears you are correct in saying they are collapsed as the balls get smaller in a uniform fashion as you
Electronics Forum | Tue Jul 05 13:11:46 EDT 2011 | markhoch
Hi Bill, I agree with not cleaning the no-clean. If you're looking for a cleaner because one of your customers is requiring no residue be left on the PCB's, I'd investigate switching to a Water Soluable Process for those specific assemblies. (You'll
Electronics Forum | Thu Mar 29 07:37:45 EDT 2012 | davef
The current discussion about solder fountains has to do with copper dissolution. Broadly, copper dissolution is the weakening of copper traces where a trace and a barrel plating intersect due a loss of the copper into the solder. Longer contact time
Electronics Forum | Wed Feb 27 08:31:02 EST 2013 | anton99
We are a OEM and growing pretty fast. The like the idea of setting up common components on the machine. It makes sense from a set up perspective. All of our set up is off line but the set up usually lasts longer than the SMT run so we have some spora
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