Electronics Forum: longer (Page 88 of 116)

Re: Hot-Air Leveling.

Electronics Forum | Tue Jun 09 09:17:21 EDT 1998 | Earl Moon

| Hello, | Some time ago before I was an engineer the company that I work for now made it a company policy to not allow hot air leveling for reasons that I do not know about yet. All I know that this policyt agreed with the MIL standards at the time

Re: Hot-Air Leveling. / Earl You Chicken

Electronics Forum | Tue Jun 09 12:39:47 EDT 1998 | Dave F

| | Hello, | | Some time ago before I was an engineer the company that I work for now made it a company policy to not allow hot air leveling for reasons that I do not know about yet. All I know that this policyt agreed with the MIL standards at the

Re: Hot-Air Leveling. / Earl You Chicken

Electronics Forum | Tue Jun 09 13:08:30 EDT 1998 | Earl Moon

| | | Hello, | | | Some time ago before I was an engineer the company that I work for now made it a company policy to not allow hot air leveling for reasons that I do not know about yet. All I know that this policyt agreed with the MIL standards at

Re: Residue

Electronics Forum | Wed May 27 14:20:43 EDT 1998 | Earl Moon

| We recently made the switch to no-clean and the wurface mount is turning out beautifully. However, the wave solder process continues to put up a fight; we are getting a white residue on the surface of the PCB. The residue is not localized to

Re: Residue/Cure Testing Of Solder Mask

Electronics Forum | Fri May 29 17:07:00 EDT 1998 | Dave F

| | We recently made the switch to no-clean and the wurface mount is turning out beautifully. However, the wave solder process continues to put up a fight; we are getting a white residue on the surface of the PCB. The residue is not localized

Re: Component Baking

Electronics Forum | Fri May 22 16:08:05 EDT 1998 | Steve Gregory

Hi ya' Mike! For low temperature baking, IPC-SM-786A (Procedures for Characterizing and Handling of Moisture/Reflow Sensitive IC's) specifies a low temperature bake that can be done in the component shipping packaging...ya' wanna remove the bubb

Re: Entek coating

Electronics Forum | Wed Mar 11 11:05:06 EST 1998 | Earl Moon

| I am having a problem with Entek coated boards. The solder past seem to just ball up on the pads. I had no problems with the board when it was hot air leveled. The board is double sided surface mount. I have tried adjusting the oven profiles mak

Re: Entek coating

Electronics Forum | Sun Mar 15 23:58:01 EST 1998 | Phill Hunter

| | I am having a problem with Entek coated boards. The solder past seem to just ball up on the pads. I had no problems with the board when it was hot air leveled. The board is double sided surface mount. I have tried adjusting the oven profiles m

Re: SMT rework station

Electronics Forum | Mon Dec 29 09:37:25 EST 1997 | Craig Wilmer

| Can anybody give me feed back on the pro and cons of | using Pace, OK, Hakko, Metcal, etc... Kris, Pace is going to be your best bet when it comes to productivity. I used to do rework and repair for Compaq and all of the PCA lines in their manufa

Re: Vapour Phase Soldering

Electronics Forum | Thu Dec 11 09:57:38 EST 1997 | Alan Brewin

Thanks to Scott for your reply, much appreciated. Are you aware of any new developments in this area? Particularly in respect to the solvents? We are aware that fluorine chemistry is now in-use with amazingly high boiling points. We understand that


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