Electronics Forum | Wed May 27 14:20:43 EDT 1998 | Earl Moon
| We recently made the switch to no-clean and the wurface mount is turning out beautifully. However, the wave solder process continues to put up a fight; we are getting a white residue on the surface of the PCB. The residue is not localized to
Electronics Forum | Fri May 29 17:07:00 EDT 1998 | Dave F
| | We recently made the switch to no-clean and the wurface mount is turning out beautifully. However, the wave solder process continues to put up a fight; we are getting a white residue on the surface of the PCB. The residue is not localized
Electronics Forum | Fri May 22 16:08:05 EDT 1998 | Steve Gregory
Hi ya' Mike! For low temperature baking, IPC-SM-786A (Procedures for Characterizing and Handling of Moisture/Reflow Sensitive IC's) specifies a low temperature bake that can be done in the component shipping packaging...ya' wanna remove the bubb
Electronics Forum | Wed Mar 11 11:05:06 EST 1998 | Earl Moon
| I am having a problem with Entek coated boards. The solder past seem to just ball up on the pads. I had no problems with the board when it was hot air leveled. The board is double sided surface mount. I have tried adjusting the oven profiles mak
Electronics Forum | Sun Mar 15 23:58:01 EST 1998 | Phill Hunter
| | I am having a problem with Entek coated boards. The solder past seem to just ball up on the pads. I had no problems with the board when it was hot air leveled. The board is double sided surface mount. I have tried adjusting the oven profiles m
Electronics Forum | Mon Dec 29 09:37:25 EST 1997 | Craig Wilmer
| Can anybody give me feed back on the pro and cons of | using Pace, OK, Hakko, Metcal, etc... Kris, Pace is going to be your best bet when it comes to productivity. I used to do rework and repair for Compaq and all of the PCA lines in their manufa
Electronics Forum | Thu Dec 11 09:57:38 EST 1997 | Alan Brewin
Thanks to Scott for your reply, much appreciated. Are you aware of any new developments in this area? Particularly in respect to the solvents? We are aware that fluorine chemistry is now in-use with amazingly high boiling points. We understand that
Electronics Forum | Wed Aug 08 10:58:29 EDT 2001 | delnosa
Understand your advise, but don't know if you've dealt with Asian (Taiwan, China, Malaysia, etc.) motherboard suppliers in the past. They have some of the most technically advanced equipment and some of the most challenging products to produce, but
Electronics Forum | Mon Aug 13 17:38:05 EDT 2001 | fmonette
Praveen, Once you find out the MS level of your components, you will need to track the exposure time from when the parts are initially removed from their dry bags, through test, programming, taping, and during subsequent dry storage and use of thes
Electronics Forum | Wed Sep 19 15:32:24 EDT 2001 | jschake
I�ll volunteer to answer this one for Jake. In order to prove the performance and capability of the stencil printing process, I think this level of inspection detail is required. However, in a production scenario where a known printing performance
