Electronics Forum | Tue Aug 24 14:49:58 EDT 2004 | jamyboy
Hi, I am trying to assemble a LTCC component > with Pd/Ag surface finish on to Sn/Pb/Ag solder > and Sn/Ag/Cu solder. I am passing it through a > reflow. I have observed poor wettability at the > solder-pad joint. Does anyone have information
Electronics Forum | Fri Sep 10 12:34:40 EDT 2004 | kbayram
Thanks again for your insights. I'm just learning the details of these machines so you'ill have to bear with me. The descision will be made in around 6 months so I thought I would start my research sooner rather than later. I did get the impression
Electronics Forum | Wed Dec 15 04:00:11 EST 2004 | Base
Hi Serge, First of all: "i HAVE to buy"...? Sounds like someone is twisting your arm to buy a piece of iron you're not really enthousiastic about... But on a serious note: I've been comparing some machinery myself (also with Pana and Siemens) and I
Electronics Forum | Wed Dec 15 07:12:20 EST 2004 | vinitverma
Does Serge need bacons or turkeys?? None of them?? Then let him think about which machine suits his requirements! Throughput, flexibility, large board handling, output derating across board size variation and component size variation! Future proof -
Electronics Forum | Thu Dec 16 03:39:00 EST 2004 | Base
Hi Rob, I can understand why you'r so passionate about your beloved Fuji's and judging by what I'm reading you have every reason to be. But also know this, (Fastek already pointed it out, but I'd like to emphasize it): a company's reputation, be it
Electronics Forum | Mon May 09 12:26:17 EDT 2005 | stepheniii
If followed, would the following strategy meet the requirements of IPC/JEDEC J-STD-033A; All MSD components are either exposed for less than 1/2 an hour or final reflowed within 12 hours of opening. What I mean by exposed is any time the parts are n
Electronics Forum | Fri Dec 16 08:00:26 EST 2005 | jax
What you are most likely dealing with: Insufficient Pure Sn layer ( multiple causes ) Because elevated temperatures accelerate the diffusion process, the thickness of the Pure Sn layer will reduce during every thermal cycle... ( bakeing PCBs, S
Electronics Forum | Thu Feb 16 17:01:23 EST 2006 | darby
Never had anything to do with Soltec so I cannot comment on their service. However. You must realise that machine manufacturers/distributors incur a cost in storing spare parts and making them available for immediate delivery. They are not held on co
Electronics Forum | Fri Feb 24 10:21:59 EST 2006 | Board House
TM, When picking a material for your lead free assembly you need to think about a couple of things, The standard Material in the US that is being used is running 140 - 170 tg. material. But for lead free assembly you need to focus on is Decomp tem
Electronics Forum | Fri Mar 17 16:58:52 EST 2006 | mikecollier
We are currently struggling with a particularly difficult component selection form our designers. This is a custom BGA, 592 balls, metal cover with a very large bead of adhesive using to retain the cover. We have had significant fallout (greater th
