Electronics Forum | Mon Jul 05 03:44:53 EDT 2004 | johnwnz
Dave, I'm going to disagree with you on the ENIG, it's my 3rd choice only just beating out OSP for that 4th spot. 1. Immersion Silver - cheaper than ENIG, as flat and no issues with Brittle interface (black pad) or Gold Embrittlement) Longer shelf l
Electronics Forum | Mon Jul 05 03:53:36 EDT 2004 | johnwnz
Hey, this is something that I've looked at and published a paper on back in 2003 at Apex, actually pert of one, the other part was lookign at how effective X-ray systems (lamanography systems) were at detecting & measuring BGA void size accuratly (co
Electronics Forum | Thu Aug 26 00:27:45 EDT 2004 | valuems
There is so much confusion about this cognex not reconized statement, and it's time to step in. The box on the out side is a cognex 2000 system. The reason for the cognex not reconized statement is very simple. MPM wrote the 4.1y software looking
Electronics Forum | Tue Aug 24 14:49:58 EDT 2004 | jamyboy
Hi, I am trying to assemble a LTCC component > with Pd/Ag surface finish on to Sn/Pb/Ag solder > and Sn/Ag/Cu solder. I am passing it through a > reflow. I have observed poor wettability at the > solder-pad joint. Does anyone have information
Electronics Forum | Fri Sep 10 12:34:40 EDT 2004 | kbayram
Thanks again for your insights. I'm just learning the details of these machines so you'ill have to bear with me. The descision will be made in around 6 months so I thought I would start my research sooner rather than later. I did get the impression
Electronics Forum | Wed Dec 15 04:00:11 EST 2004 | Base
Hi Serge, First of all: "i HAVE to buy"...? Sounds like someone is twisting your arm to buy a piece of iron you're not really enthousiastic about... But on a serious note: I've been comparing some machinery myself (also with Pana and Siemens) and I
Electronics Forum | Wed Dec 15 07:12:20 EST 2004 | vinitverma
Does Serge need bacons or turkeys?? None of them?? Then let him think about which machine suits his requirements! Throughput, flexibility, large board handling, output derating across board size variation and component size variation! Future proof -
Electronics Forum | Thu Dec 16 03:39:00 EST 2004 | Base
Hi Rob, I can understand why you'r so passionate about your beloved Fuji's and judging by what I'm reading you have every reason to be. But also know this, (Fastek already pointed it out, but I'd like to emphasize it): a company's reputation, be it
Electronics Forum | Mon May 09 12:26:17 EDT 2005 | stepheniii
If followed, would the following strategy meet the requirements of IPC/JEDEC J-STD-033A; All MSD components are either exposed for less than 1/2 an hour or final reflowed within 12 hours of opening. What I mean by exposed is any time the parts are n
Electronics Forum | Fri Dec 16 08:00:26 EST 2005 | jax
What you are most likely dealing with: Insufficient Pure Sn layer ( multiple causes ) Because elevated temperatures accelerate the diffusion process, the thickness of the Pure Sn layer will reduce during every thermal cycle... ( bakeing PCBs, S
