Electronics Forum: longer (Page 94 of 117)

i have to buy one NXT from Fuji What do you think???

Electronics Forum | Wed Dec 15 07:12:20 EST 2004 | vinitverma

Does Serge need bacons or turkeys?? None of them?? Then let him think about which machine suits his requirements! Throughput, flexibility, large board handling, output derating across board size variation and component size variation! Future proof -

i have to buy one NXT from Fuji What do you think???

Electronics Forum | Thu Dec 16 03:39:00 EST 2004 | Base

Hi Rob, I can understand why you'r so passionate about your beloved Fuji's and judging by what I'm reading you have every reason to be. But also know this, (Fastek already pointed it out, but I'd like to emphasize it): a company's reputation, be it

BGA & QFP post reflow inspection

Electronics Forum | Mon May 09 12:26:17 EDT 2005 | stepheniii

If followed, would the following strategy meet the requirements of IPC/JEDEC J-STD-033A; All MSD components are either exposed for less than 1/2 an hour or final reflowed within 12 hours of opening. What I mean by exposed is any time the parts are n

Immersion white tin wave soldering problem

Electronics Forum | Fri Dec 16 08:00:26 EST 2005 | jax

What you are most likely dealing with: Insufficient Pure Sn layer ( multiple causes ) Because elevated temperatures accelerate the diffusion process, the thickness of the Pure Sn layer will reduce during every thermal cycle... ( bakeing PCBs, S

Soltec Parts - cheap?

Electronics Forum | Thu Feb 16 17:01:23 EST 2006 | darby

Never had anything to do with Soltec so I cannot comment on their service. However. You must realise that machine manufacturers/distributors incur a cost in storing spare parts and making them available for immediate delivery. They are not held on co

PCB Material

Electronics Forum | Fri Feb 24 10:21:59 EST 2006 | Board House

TM, When picking a material for your lead free assembly you need to think about a couple of things, The standard Material in the US that is being used is running 140 - 170 tg. material. But for lead free assembly you need to focus on is Decomp tem

Question on Thermal Overstress on BGA Balls During Rework

Electronics Forum | Fri Mar 17 16:58:52 EST 2006 | mikecollier

We are currently struggling with a particularly difficult component selection form our designers. This is a custom BGA, 592 balls, metal cover with a very large bead of adhesive using to retain the cover. We have had significant fallout (greater th

Strange problem with Fuji IP1 stopping

Electronics Forum | Thu Mar 30 13:27:53 EST 2006 | bvdb

Just before Christmas we bought a used Fuji IP1 cheap. It took us a while but it's been working great for about a month. Yesterday the IP1 stopped after completing a board but before exiting the board out the conveyer. No error message, no alarm be

Siemens S15/F3 skipping component

Electronics Forum | Tue Apr 11 11:40:41 EDT 2006 | global

We have a Siemens S15 and an F3, which we have only had now for about 4 months. We have an old line of HS180s and an SP120 and have found that the S15 and F3 do not have the option to skip a part if one runs out during placement. We from time to time

Tip life of soldering irons with lead-free (SAC305)

Electronics Forum | Fri May 12 07:53:40 EDT 2006 | egrice1

Sheldon, Tip life is directly related to temperature, IRON plating thickness on the tip, Alloy composition used and operator technique. High tin contents in lead free alloys attach the tips. Poor wetting and higher melting temperatures cause us


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