Electronics Forum | Mon Feb 18 17:36:32 EST 2008 | kennyg
I should have mentioned... the only flux we use for the hand soldering is wire-core, no bottle flux. I think it should be a non-issue to leave the activated wire core flux residue. I'm just looking for some way to prove it to the designer.
Electronics Forum | Tue Dec 19 16:26:24 EST 2006 | samir
Grant, Newer lead-free fluxes have 6%-10% solids content - more activator, therefore leave more "visible" residues. Old technology tin-lead fluxes got down to as low as around the 4%-6% range (I'm going off memory, so me might be wrong)... You'll
Electronics Forum | Tue Jan 08 11:28:30 EST 2002 | mregalia
We use NC flux exclusively for SMT and wave soldering. And it is a fairly old formula from Multicore, though we are currently qualifying a new formula. The automated soldering does not appear to be a problem. It is only the hand soldering that causes
Electronics Forum | Fri Nov 03 09:41:17 EDT 2017 | davef
On your question about reliability ... " Is there testing we can do (environmental stress chambers) with which we can see the long-term effects of flux residue on solder joints?" Sure, incompletely activated low residue flux residues are potentially
Electronics Forum | Tue Sep 21 13:10:10 EDT 1999 | Dave F
| Dear All, | | In order to understand the soldering technologies in SMT, I'd like to understand why some cards are soldered and then cleaned, or only soldered whitout water cleaning nor "ultra sound" wavelength. | | I mean that I wonder why we use
Electronics Forum | Wed Sep 22 02:45:23 EDT 1999 | Brian
| | Dear All, | | | | In order to understand the soldering technologies in SMT, I'd like to understand why some cards are soldered and then cleaned, or only soldered whitout water cleaning nor "ultra sound" wavelength. | | | | I mean that I wonder
Electronics Forum | Mon Feb 01 16:40:45 EST 1999 | Dave Waddick
I have a product using high temperature solder to connect terminal pins to a PCB. The board is single sided copper, no plaiting. The solder is 95% tin 5 % silver. The flux is low activity rosin. The product is a subassembly. When the product is
Electronics Forum | Tue Feb 02 12:31:26 EST 1999 | John
| I have a product using high temperature solder to connect terminal pins to a PCB. The board is single sided copper, no plaiting. The solder is 95% tin 5 % silver. The flux is low activity rosin. The product is a subassembly. When the product i
Electronics Forum | Mon Jun 12 22:00:51 EDT 2000 | Dave F
Could be. What are your profiles? 2) Au finish fail => Could be, but that the connections can be made with hand soldering makes this a low probability cause, assuming the activity of the flux used in hand soldering is not significantly different fr
Electronics Forum | Mon Jun 25 20:35:44 EDT 2001 | davef
According to J-STD-004 "Requirements for Soldering Fluxes", fluxes are classified by their chemical composition, activity level and halide content. In this scheme, each flux type is identified by a 4-character designator, where: * First two character
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