Electronics Forum | Tue Nov 07 08:01:10 EST 2006 | davef
We/ve never heard of "glass wicking failure" in regards to board fab. Boat fab, yes. Look here: http://www.boatdesign.net/forums/showthread.php?t=13321 Barrel cracking appears after thermal stress during soldering, because epoxy expands in the "z"
Electronics Forum | Wed Oct 29 06:17:45 EDT 2014 | julianf
As stated in the title I would like to know the thermo-elastic material properties, most preferably the E-modulus and CTE in x- and y-direction, for Epoxy/E-glass laminates and/or prepregs for various fibreglass cloth styles. Datasheets only give ro
Electronics Forum | Wed Feb 24 16:47:30 EST 1999 | Earl Moon
| Fab Gurus, (Earl) | What are the disadvantages of using paper phrenwhatsit as a substrate. I want to justify changing a substrate from paper to chem3 or FR4 and I need some info regarding long term failure issues, etc. | | Thanks, | Justin | Jus
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