Electronics Forum: low insulation resistance in capacitor (Page 1 of 1)

Conformal Coating in New England

Electronics Forum | Fri Jan 13 06:54:12 EST 2006 | pjc

Here's a couple more: Vitek Coating Div., Vitek Research Corp. - Derby, CT - Contact Service Company Company Profile: Parylene Conformal Coating Services With Plasma Surface Treatment To Enhance Adhesion. Electrostatic Powder & Liquid Coating Of Med

How to strengthen the ability of anti-interference in PCB design

Electronics Forum | Thu Nov 20 03:58:39 EST 2014 | hhat

To get the best performance of electronic circuits, components and circuit board supports circuit components and devices in electronic products. Even if the circuit principle diagram design is correct, the printed circuit board is designed improperly

Re: CSP Assembly- SIR Test

Electronics Forum | Thu Dec 31 01:09:18 EST 1998 | Kelvin Chow

Dear Micheal, SIR test is used to characterize fluxes by determining the degration of electrical insulation resistance of rigid printed wiring board specimens after exposure to the specified flux. (IPC TM-650 #2.6.3.3 http://www.ipc.org/html/tm2.6.h

Re: CSP Assembly- SIR Test

Electronics Forum | Thu Dec 31 14:20:35 EST 1998 | Michael Allen

Kelvin, Yes, we're referencing the same spec. I performed the test under the Class 2 conditions (except that I used a 100V bias rather than 50V...but my water-washed microBGAs still passed). Regarding the omegameter test: we have this instrument,

Re: CSP Assembly- No-clean vs Aqueous

Electronics Forum | Wed Dec 30 17:34:23 EST 1998 | Michael Allen

I'm afraid we don't agree regarding the best test method to use here. My understanding is as follows. The omegameter test measures board-level, ionic contamination (i.e., average for the entire board area and all components); it does not tell you w

10 Methods for PCB Heat Dissipation

Electronics Forum | Mon Oct 26 02:00:36 EDT 2020 | chucherry5076

https://www.jrpanel.com/R The heat generated by electronic equipment causes the internal temperature to rise rapidly. If the heat is not dissipated in time, the equipment will continue to heat up and the components will overheat and fail, resulting

Re: DFM / DFT information

Electronics Forum | Thu Jul 13 22:20:38 EDT 2000 | Dave F

=10 mils larger than lead 3 silk screen legend text weight >=10 mils 4 pads >=15 mils larger than finished hole sizes 5 place through hole components on 50 mil grid 6 no silk screen legend text over vias (if vias not solder masked) or holes 7 so

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