Electronics Forum | Wed Apr 26 12:38:33 EDT 2006 | TMC
I would suggest you do the following: get a sample / scrap board that you will be reflowing, attach thermocouples at various locations on the board, send the board to APS or whomever. Ask them to run a profile based on your solder pastes manufactur
Electronics Forum | Mon May 12 18:45:57 EDT 2008 | locostpp
Hi All, We are embarking on the design of an ultra low-cost pick and place machine for use by small manufacturers & would appreciate some input. Here are some points: Low cost - in the region of $6-11k (higher cost versions faster) Two cameras (up
Electronics Forum | Mon May 12 15:08:53 EDT 2014 | davef
I've never used SAC405. Not for nothing ... Other low temperature solder alloys that you should consider are: * Sn42/Bi58 [138*C]: Alloy for low temperature applications. Attention should be paid to potential embrittlement issues and poor thermal fa
Electronics Forum | Tue May 13 08:59:13 EDT 2014 | gazelle
Hello davef - could it be you are confusing low thermal emf (Seebeck coefficient) with low temperature solder ? I am looking after solder wire and paste with low Seebeck coefficient - cadmium based alloy was OK but banned in europe due to RoHs direct
Electronics Forum | Tue Dec 28 20:31:48 EST 1999 | Jim
Justin, I have a customer who is considering changing from TH to SMT, but his preliminary reliability testing yielded solder joint failures, because his product must endure severe temperature swings. He can't change to an expensive substrate, or he'
Electronics Forum | Wed Dec 29 15:42:34 EST 1999 | Mike Naddra
Justin, I would be currious as to your customers application, and if the temperature delta and rate are great enough to cause solder joint failures as a function of mismatched Tce then you may want to consider that even if you are able to identify
Electronics Forum | Thu Dec 30 21:22:12 EST 1999 | Jim
Mike, Thanks for the reply. It's not really a matter of slope. It is the long term thermomechanical fatigue that the solder joint undergoes as a result of repeated severe temperature swings, while the product is in use. Non-leaded parts are suscep
Electronics Forum | Tue Jun 18 04:01:07 EDT 2019 | aite
Hi! You can choose low-temperature solder paste. The low-temperature solder paste is tin and antimony with a melting point of 138 °C. When the components of the patch cannot withstand the temperature of 200 ° C and above and the patch reflow process
Electronics Forum | Wed Dec 19 20:42:55 EST 2007 | davef
gersla: You're correct that carriers of low temperature material will disfigure and become useless at 125*C bake temperatures. The reason you can not find 70*C bake data is: J-STD033B, "4.2.2 Low Temperature Carriers. SMD packages shipped in low tem
Electronics Forum | Thu May 21 11:30:59 EDT 1998 | Mike Glenn
Does anyone know about low pressure/low temperature ovens used for baking of moisture senstive components? Thanks
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