Electronics Forum | Fri May 22 16:08:05 EDT 1998 | Steve Gregory
Hi ya' Mike! For low temperature baking, IPC-SM-786A (Procedures for Characterizing and Handling of Moisture/Reflow Sensitive IC's) specifies a low temperature bake that can be done in the component shipping packaging...ya' wanna remove the bubb
Electronics Forum | Fri Jul 30 17:22:48 EDT 1999 | Dave F
| | Surface Mount Components like QFP's in Tray usually comes sealed in an anti-static plastic pack. In case the QFP's were removed from the said anti-static bag for more than 2 weeks, do these components needed to be baked for they might produce so
Electronics Forum | Mon Jun 16 13:57:48 EDT 2003 | James
Could anyone give me a basic profile temperature settings for a conceptronics 7 zone oven and speed? I have the first couple of zones ramped up to get to the soak temperatures. Is this correct or should I start out with low temperatures and graduall
Electronics Forum | Thu Feb 22 21:01:12 EST 2001 | davef
We don't do this, but if we had to and lacking better advice, for all components I�d dry pack according to J-STD-033, store in a low temperature and humidity controlled environment [maybe using some semicon fab inert storage cabinets], review the eff
Electronics Forum | Tue Oct 24 22:36:29 EDT 2000 | DL
On the main page of Smtnet towards the end of the opening paragraph states the following...Your " research continues in determining the reliability of thick film hybrid microcircuits and similar technologies using low-temperature, co-fired ceramics.
Electronics Forum | Wed Aug 23 08:55:39 EDT 2000 | Dave F
Dr. Lee: Taking a tangent on your response ... When talking about alternate solders. Bismuth forms an alloy with lead with a melting point of 93�C. Are there special conditions that cause this alloy to form? Or does the alloy form commonly when
Electronics Forum | Tue Aug 22 11:17:04 EDT 2000 | Dr. Ning-Cheng Lee
The classic dilemma, cost vs. performance. In typical applications, Sn whisker growth is not an issue. It only seems to occur under extreme use (high stress, low temperature)conditions. Until this issue is fully addressed, Pd seems to be the favor
Electronics Forum | Wed Mar 05 09:34:32 EST 2003 | HAROLD LICHT
WE HAVE A NEED TO BOND SOME LOW TEMPERATURE LED'S TO A THIN CIRCUIT BOARD LAMINATED TO A HEAT SINK. HAS ANYONE USED AN ULTRASONIC WELDER TO WELD COPPER GUL WING LEADS TO A COPPER PAD USING ULTRASONICS? IF NOT HAS ANYONE USED RESISTANCE SPOT WELDING
Electronics Forum | Tue Feb 08 15:05:22 EST 2005 | Keith Lengling
I have several memory devices that have 2% bismuth in the lead coating. Is this enough bismuth to be concerned over the formation of a low temperature SnPbBi alloy? What are the allowable limits for bismuth in an SnPb process for both SMT and through
Electronics Forum | Tue Dec 13 09:15:56 EST 2005 | Samir Nagaheenanajar
5% Bi results in less plasticity * Formation of low temperature (ternerary phases) not detected. I don't advocate the use of Bismuth, per se, but rather I'm just relaying info. that I learned this from a Lead-Free seminar that I attended at Riyadh
